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Compare | Image | Part No | Manufacturer | Description | Inventory | Pricing | Quantity | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature | Termination Post Length | Material Flammability Rating | Current Rating (Amps) | Contact Resistance |
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Mfr Part No.24-6511-10Internal Code270-409-1373357 | Aries Electronics |
CONN IC DIP SOCKET 24POS TIN
| Get a Quote | - | 511 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C | 0.150" (3.81mm) | UL94 V-0 | 1 A | - | |||
24-6511-10 | |||||||||||||||||||||||||||||
Mfr Part No.24-6513-10TInternal Code270-409-1373361 | Aries Electronics |
CONN IC DIP SOCKET 24POS GOLD
| Get a Quote | - | Lo-PRO®file, 513 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C | 0.125" (3.18mm) | UL94 V-0 | 3 A | - | |||
24-6513-10T | |||||||||||||||||||||||||||||
Mfr Part No.24-6513-11Internal Code270-409-1373362 | Aries Electronics |
CONN IC DIP SOCKET 24POS GOLD
| Get a Quote | - | Lo-PRO®file, 513 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C | 0.125" (3.18mm) | UL94 V-0 | 3 A | - | |||
24-6513-11 | |||||||||||||||||||||||||||||
Mfr Part No.24-6513-11HInternal Code270-409-1373363 | Aries Electronics |
CONN IC DIP SOCKET 24POS GOLD
| Get a Quote | - | Lo-PRO®file, 513 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C | 0.125" (3.18mm) | UL94 V-0 | 3 A | - | |||
24-6513-11H | |||||||||||||||||||||||||||||
Mfr Part No.24-6518-10EInternal Code270-409-1373370 | Aries Electronics |
CONN IC DIP SOCKET 24POS GOLD
| Get a Quote | - | 518 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - | 0.125" (3.18mm) | UL94 V-0 | 3 A | - | |||
24-6518-10E | |||||||||||||||||||||||||||||
Mfr Part No.24-6518-111Internal Code270-409-1373375 | Aries Electronics |
CONN IC DIP SOCKET 24POS GOLD
| Get a Quote | - | 518 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - | 0.125" (3.18mm) | UL94 V-0 | 3 A | - | |||
24-6518-111 | |||||||||||||||||||||||||||||
Mfr Part No.24-6518-112Internal Code270-409-1373376 | Aries Electronics |
CONN IC DIP SOCKET 24POS GOLD
| Get a Quote | - | 518 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - | 0.125" (3.18mm) | UL94 V-0 | 3 A | - | |||
24-6518-112 | |||||||||||||||||||||||||||||
Mfr Part No.24-6518-11HInternal Code270-409-1373377 | Aries Electronics |
CONN IC DIP SOCKET 24POS GOLD
| Get a Quote | - | 518 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - | 0.125" (3.18mm) | UL94 V-0 | 3 A | - | |||
24-6518-11H | |||||||||||||||||||||||||||||
Mfr Part No.24-6551-11Internal Code270-409-1373393 | Aries Electronics |
CONN IC DIP SOCKET ZIF 24POS GLD
| Get a Quote | - | 55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - | 0.110" (2.78mm) | UL94 V-0 | 1 A | - | |||
24-6551-11 | |||||||||||||||||||||||||||||
Mfr Part No.24-6551-18Internal Code270-409-1373395 | Aries Electronics |
CONN IC DIP SOCKET ZIF 24POS
| Get a Quote | - | 55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Polyetheretherketone (PEEK), Glass Filled | -55°C ~ 250°C | 0.110" (2.78mm) | UL94 V-0 | 1 A | - | |||
24-6551-18 | |||||||||||||||||||||||||||||
Mfr Part No.24-6552-11Internal Code270-409-1373397 | Aries Electronics |
CONN IC DIP SOCKET ZIF 24POS GLD
| Get a Quote | - | 55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - | 0.110" (2.78mm) | UL94 V-0 | 1 A | - | |||
24-6552-11 | |||||||||||||||||||||||||||||
Mfr Part No.24-6556-11Internal Code270-409-1373410 | Aries Electronics |
CONN IC DIP SOCKET 24POS GOLD
| Get a Quote | - | 6556 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled | - | 0.130" (3.30mm) | UL94 V-0 | 3 A | - | |||
24-6556-11 | |||||||||||||||||||||||||||||
Mfr Part No.24-6556-21Internal Code270-409-1373412 | Aries Electronics |
CONN IC DIP SOCKET 24POS GOLD
| Get a Quote | - | 6556 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled | - | 0.283" (7.19mm) | UL94 V-0 | 3 A | - | |||
24-6556-21 | |||||||||||||||||||||||||||||
Mfr Part No.24-6570-10Internal Code270-409-1373423 | Aries Electronics |
CONN IC DIP SOCKET ZIF 24POS TIN
| Get a Quote | - | 57 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - | 0.110" (2.78mm) | UL94 V-0 | 1 A | - | |||
24-6570-10 | |||||||||||||||||||||||||||||
Mfr Part No.24-6571-11Internal Code270-409-1373428 | Aries Electronics |
CONN IC DIP SOCKET ZIF 24POS GLD
| Get a Quote | - | 57 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - | 0.110" (2.78mm) | UL94 V-0 | 1 A | - | |||
24-6571-11 | |||||||||||||||||||||||||||||
Mfr Part No.24-6572-10Internal Code270-409-1373430 | Aries Electronics |
CONN IC DIP SOCKET ZIF 24POS TIN
| Get a Quote | - | 57 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - | 0.110" (2.78mm) | UL94 V-0 | 1 A | - | |||
24-6572-10 | |||||||||||||||||||||||||||||
Mfr Part No.24-6573-11Internal Code270-409-1373434 | Aries Electronics |
CONN IC DIP SOCKET ZIF 24POS GLD
| Get a Quote | - | 57 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - | 0.110" (2.78mm) | UL94 V-0 | 1 A | - | |||
24-6573-11 | |||||||||||||||||||||||||||||
Mfr Part No.24-6574-10Internal Code270-409-1373436 | Aries Electronics |
CONN IC DIP SOCKET ZIF 24POS TIN
| Get a Quote | - | 57 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - | 0.110" (2.78mm) | UL94 V-0 | 1 A | - | |||
24-6574-10 | |||||||||||||||||||||||||||||
Mfr Part No.24-6575-11Internal Code270-409-1373441 | Aries Electronics |
CONN IC DIP SOCKET ZIF 24POS TIN
| Get a Quote | - | 57 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - | 0.110" (2.78mm) | UL94 V-0 | 1 A | - | |||
24-6575-11 | |||||||||||||||||||||||||||||
Mfr Part No.24-6575-16Internal Code270-409-1373442 | Aries Electronics |
CONN IC DIP SOCKET ZIF 24POS TIN
| Get a Quote | - | 57 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - | 0.110" (2.78mm) | UL94 V-0 | 1 A | - | |||
24-6575-16 |