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Compare Image Part No Manufacturer Description Inventory Pricing Quantity SeriesPackagingPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating TemperatureTermination Post LengthMaterial Flammability RatingCurrent Rating (Amps)Contact Resistance
Compare Image Part No Manufacturer Description Inventory Pricing Quantity SeriesPackagingPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating TemperatureTermination Post LengthMaterial Flammability RatingCurrent Rating (Amps)Contact Resistance
24-6511-10

Mfr Part No.

24-6511-10

Internal Code

270-409-1373357
Aries Electronics
CONN IC DIP SOCKET 24POS TIN
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511 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C 0.150" (3.81mm) UL94 V-0 1 A -
24-6511-10
24-6511-10

270-409-1373357 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
24-6513-10T

Mfr Part No.

24-6513-10T

Internal Code

270-409-1373361
Aries Electronics
CONN IC DIP SOCKET 24POS GOLD
Get a Quote -
Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C 0.125" (3.18mm) UL94 V-0 3 A -
24-6513-10T
24-6513-10T

270-409-1373361 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
24-6513-11

Mfr Part No.

24-6513-11

Internal Code

270-409-1373362
Aries Electronics
CONN IC DIP SOCKET 24POS GOLD
Get a Quote -
Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C 0.125" (3.18mm) UL94 V-0 3 A -
24-6513-11
24-6513-11

270-409-1373362 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
24-6513-11H

Mfr Part No.

24-6513-11H

Internal Code

270-409-1373363
Aries Electronics
CONN IC DIP SOCKET 24POS GOLD
Get a Quote -
Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C 0.125" (3.18mm) UL94 V-0 3 A -
24-6513-11H
24-6513-11H

270-409-1373363 Aries Electronics
RoHS :
Package: -
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1 : -
24-6518-10E

Mfr Part No.

24-6518-10E

Internal Code

270-409-1373370
Aries Electronics
CONN IC DIP SOCKET 24POS GOLD
Get a Quote -
518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled - 0.125" (3.18mm) UL94 V-0 3 A -
24-6518-10E
24-6518-10E

270-409-1373370 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
24-6518-111

Mfr Part No.

24-6518-111

Internal Code

270-409-1373375
Aries Electronics
CONN IC DIP SOCKET 24POS GOLD
Get a Quote -
518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled - 0.125" (3.18mm) UL94 V-0 3 A -
24-6518-111
24-6518-111

270-409-1373375 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
24-6518-112

Mfr Part No.

24-6518-112

Internal Code

270-409-1373376
Aries Electronics
CONN IC DIP SOCKET 24POS GOLD
Get a Quote -
518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled - 0.125" (3.18mm) UL94 V-0 3 A -
24-6518-112
24-6518-112

270-409-1373376 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
24-6518-11H

Mfr Part No.

24-6518-11H

Internal Code

270-409-1373377
Aries Electronics
CONN IC DIP SOCKET 24POS GOLD
Get a Quote -
518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled - 0.125" (3.18mm) UL94 V-0 3 A -
24-6518-11H
24-6518-11H

270-409-1373377 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
24-6551-11

Mfr Part No.

24-6551-11

Internal Code

270-409-1373393
Aries Electronics
CONN IC DIP SOCKET ZIF 24POS GLD
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55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled - 0.110" (2.78mm) UL94 V-0 1 A -
24-6551-11
24-6551-11

270-409-1373393 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
24-6551-18

Mfr Part No.

24-6551-18

Internal Code

270-409-1373395
Aries Electronics
CONN IC DIP SOCKET ZIF 24POS
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55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C 0.110" (2.78mm) UL94 V-0 1 A -
24-6551-18
24-6551-18

270-409-1373395 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
24-6552-11

Mfr Part No.

24-6552-11

Internal Code

270-409-1373397
Aries Electronics
CONN IC DIP SOCKET ZIF 24POS GLD
Get a Quote -
55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled - 0.110" (2.78mm) UL94 V-0 1 A -
24-6552-11
24-6552-11

270-409-1373397 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
24-6556-11

Mfr Part No.

24-6556-11

Internal Code

270-409-1373410
Aries Electronics
CONN IC DIP SOCKET 24POS GOLD
Get a Quote -
6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled - 0.130" (3.30mm) UL94 V-0 3 A -
24-6556-11
24-6556-11

270-409-1373410 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
24-6556-21

Mfr Part No.

24-6556-21

Internal Code

270-409-1373412
Aries Electronics
CONN IC DIP SOCKET 24POS GOLD
Get a Quote -
6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled - 0.283" (7.19mm) UL94 V-0 3 A -
24-6556-21
24-6556-21

270-409-1373412 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
24-6570-10

Mfr Part No.

24-6570-10

Internal Code

270-409-1373423
Aries Electronics
CONN IC DIP SOCKET ZIF 24POS TIN
Get a Quote -
57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled - 0.110" (2.78mm) UL94 V-0 1 A -
24-6570-10
24-6570-10

270-409-1373423 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
24-6571-11

Mfr Part No.

24-6571-11

Internal Code

270-409-1373428
Aries Electronics
CONN IC DIP SOCKET ZIF 24POS GLD
Get a Quote -
57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled - 0.110" (2.78mm) UL94 V-0 1 A -
24-6571-11
24-6571-11

270-409-1373428 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
24-6572-10

Mfr Part No.

24-6572-10

Internal Code

270-409-1373430
Aries Electronics
CONN IC DIP SOCKET ZIF 24POS TIN
Get a Quote -
57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled - 0.110" (2.78mm) UL94 V-0 1 A -
24-6572-10
24-6572-10

270-409-1373430 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
24-6573-11

Mfr Part No.

24-6573-11

Internal Code

270-409-1373434
Aries Electronics
CONN IC DIP SOCKET ZIF 24POS GLD
Get a Quote -
57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled - 0.110" (2.78mm) UL94 V-0 1 A -
24-6573-11
24-6573-11

270-409-1373434 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
24-6574-10

Mfr Part No.

24-6574-10

Internal Code

270-409-1373436
Aries Electronics
CONN IC DIP SOCKET ZIF 24POS TIN
Get a Quote -
57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled - 0.110" (2.78mm) UL94 V-0 1 A -
24-6574-10
24-6574-10

270-409-1373436 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
24-6575-11

Mfr Part No.

24-6575-11

Internal Code

270-409-1373441
Aries Electronics
CONN IC DIP SOCKET ZIF 24POS TIN
Get a Quote -
57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled - 0.110" (2.78mm) UL94 V-0 1 A -
24-6575-11
24-6575-11

270-409-1373441 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
24-6575-16

Mfr Part No.

24-6575-16

Internal Code

270-409-1373442
Aries Electronics
CONN IC DIP SOCKET ZIF 24POS TIN
Get a Quote -
57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled - 0.110" (2.78mm) UL94 V-0 1 A -
24-6575-16
24-6575-16

270-409-1373442 Aries Electronics
RoHS :
Package: -
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