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| Compare | Image | Part No | Manufacturer | Description | Inventory | Pricing | Quantity | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature | Termination Post Length | Material Flammability Rating | Current Rating (Amps) | Contact Resistance |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No.28-0508-20Internal Code270-409-1422872 | Aries Electronics |
CONN SOCKET SIP 28POS GOLD
| Get a Quote | - | 508 | Bulk | Active | SIP | 28 (1 x 28) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6 | -55°C ~ 105°C | 0.360" (9.14mm) | UL94 V-0 | 3 A | - | ||
| 28-0508-20 | |||||||||||||||||||||||||||||
| | Mfr Part No.28-0511-10Internal Code270-409-1422894 | Aries Electronics |
CONN SOCKET SIP 28POS TIN
| Get a Quote | - | 511 | Bulk | Active | SIP | 28 (1 x 28) | 0.100" (2.54mm) | Tin | 50.0µin (1.27µm) | Phosphor Bronze | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | 50.0µin (1.27µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C | 0.150" (3.81mm) | UL94 V-0 | 1 A | - | ||
| 28-0511-10 | |||||||||||||||||||||||||||||
 | Mfr Part No.28-0518-10HInternal Code270-409-1422911 | Aries Electronics |
CONN SOCKET SIP 28POS GOLD
| Get a Quote | - | 518 | Bulk | Active | SIP | 28 (1 x 28) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - | 0.125" (3.18mm) | UL94 V-0 | 3 A | - | ||
| 28-0518-10H | |||||||||||||||||||||||||||||
| | Mfr Part No.28-0518-11Internal Code270-409-1422913 | Aries Electronics |
CONN SOCKET SIP 28POS GOLD
| Get a Quote | - | 518 | Bulk | Active | SIP | 28 (1 x 28) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - | 0.125" (3.18mm) | UL94 V-0 | 3 A | - | ||
| 28-0518-11 | |||||||||||||||||||||||||||||
| | Mfr Part No.280-PLS19006-12Internal Code270-409-1423657 | Aries Electronics |
CONN SOCKET PGA ZIF GOLD
| Get a Quote | - | PLS | Bulk | Active | PGA, ZIF (ZIP) | - | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 125°C | 0.125" (3.18mm) | UL94 V-0 | 1 A | - | ||
| 280-PLS19006-12 | |||||||||||||||||||||||||||||
| | Mfr Part No.28-1518-00Internal Code270-409-1424407 | Aries Electronics |
CONN IC DIP SOCKET 28POS GOLD
| Get a Quote | - | 518 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - | 0.125" (3.18mm) | UL94 V-0 | 3 A | - | ||
| 28-1518-00 | |||||||||||||||||||||||||||||
| | Mfr Part No.28-1518-10HInternal Code270-409-1424410 | Aries Electronics |
CONN IC DIP SOCKET 28POS GOLD
| Get a Quote | - | 518 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - | 0.125" (3.18mm) | UL94 V-0 | 3 A | - | ||
| 28-1518-10H | |||||||||||||||||||||||||||||
| | Mfr Part No.281-PGM18037-11Internal Code270-409-1425195 | Aries Electronics |
CONN SOCKET PGA GOLD
| Get a Quote | - | PGM | Bulk | Active | PGA | - | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C | 0.165" (4.19mm) | UL94 V-0 | 3 A | - | ||
| 281-PGM18037-11 | |||||||||||||||||||||||||||||
| | Mfr Part No.281-PLS19012-12Internal Code270-409-1425196 | Aries Electronics |
CONN SOCKET PGA ZIF GOLD
| Get a Quote | - | PLS | Bulk | Active | PGA, ZIF (ZIP) | - | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 125°C | 0.125" (3.18mm) | UL94 V-0 | 1 A | - | ||
| 281-PLS19012-12 | |||||||||||||||||||||||||||||
| | Mfr Part No.28-3508-20Internal Code270-409-1428375 | Aries Electronics |
CONN IC DIP SOCKET 28POS GOLD
| Get a Quote | - | 508 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C | 0.360" (9.14mm) | UL94 V-0 | 3 A | - | ||
| 28-3508-20 | |||||||||||||||||||||||||||||
| | Mfr Part No.28-3508-202Internal Code270-409-1428377 | Aries Electronics |
CONN IC DIP SOCKET 28POS GOLD
| Get a Quote | - | 508 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C | 0.360" (9.14mm) | UL94 V-0 | 3 A | - | ||
| 28-3508-202 | |||||||||||||||||||||||||||||
| | Mfr Part No.28-3508-312Internal Code270-409-1428386 | Aries Electronics |
CONN IC DIP SOCKET 28POS GOLD
| Get a Quote | - | 508 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C | 0.500" (12.70mm) | UL94 V-0 | 3 A | - | ||
| 28-3508-312 | |||||||||||||||||||||||||||||
 | Mfr Part No.28-3518-101Internal Code270-409-1428407 | Aries Electronics |
CONN IC DIP SOCKET 28POS GOLD
| Get a Quote | - | 518 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - | 0.125" (3.18mm) | UL94 V-0 | 3 A | - | ||
| 28-3518-101 | |||||||||||||||||||||||||||||
| | Mfr Part No.28-3551-16Internal Code270-409-1428450 | Aries Electronics |
CONN IC DIP SOCKET ZIF 28POS
| Get a Quote | - | 55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - | 0.110" (2.78mm) | UL94 V-0 | 1 A | - | ||
| 28-3551-16 | |||||||||||||||||||||||||||||
| | Mfr Part No.28-3575-16Internal Code270-409-1428487 | Aries Electronics |
CONN IC DIP SOCKET ZIF 28POS GLD
| Get a Quote | - | 57 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - | 0.110" (2.78mm) | UL94 V-0 | 1 A | - | ||
| 28-3575-16 | |||||||||||||||||||||||||||||
| | Mfr Part No.28-3572-10Internal Code270-409-1428475 | Aries Electronics |
CONN IC DIP SOCKET ZIF 28POS TIN
| Get a Quote | - | 57 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - | 0.110" (2.78mm) | UL94 V-0 | 1 A | - | ||
| 28-3572-10 | |||||||||||||||||||||||||||||
| | Mfr Part No.28-3570-16Internal Code270-409-1428471 | Aries Electronics |
CONN IC DIP SOCKET ZIF 28POS
| Get a Quote | - | 57 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Polyphenylene Sulfide (PPS), Glass Filled | - | 0.110" (2.78mm) | UL94 V-0 | 1 A | - | ||
| 28-3570-16 | |||||||||||||||||||||||||||||
| | Mfr Part No.28-3554-16Internal Code270-409-1428462 | Aries Electronics |
CONN IC DIP SOCKET ZIF 24POS
| Get a Quote | - | 55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | -55°C ~ 250°C | 0.110" (2.78mm) | UL94 V-0 | 1 A | - | ||
| 28-3554-16 | |||||||||||||||||||||||||||||
| | Mfr Part No.28-3552-16Internal Code270-409-1428454 | Aries Electronics |
CONN IC DIP SOCKET ZIF 28POS
| Get a Quote | - | 55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - | 0.110" (2.78mm) | UL94 V-0 | 1 A | - | ||
| 28-3552-16 | |||||||||||||||||||||||||||||
 | Mfr Part No.28-526-10Internal Code270-409-1432789 | Aries Electronics |
CONN IC DIP SOCKET ZIF 28POS TIN
| 307 Available |
|
Unit Price:
$8.4703 Minimum: 1 Multiple: 1 | Lo-PRO®file, 526 | Bulk | Active | DIP, ZIF (ZIP) | 28 (2 x 14) | 0.100" (2.54mm) | Tin | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 10.0µin (0.25µm) | Beryllium Copper | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C | 0.105" (2.67mm) | UL94 V-0 | 3 A | - | |
| 28-526-10 |