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| Compare | Image | Part No | Manufacturer | Description | Inventory | Pricing | Quantity | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature | Termination Post Length | Material Flammability Rating | Current Rating (Amps) | Contact Resistance |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No.28-526-11Internal Code270-409-1432790 | Aries Electronics |
CONN IC DIP SOCKET ZIF 28POS GLD
| 49 Available |
|
Unit Price:
$16.04 Minimum: 1 Multiple: 1 | Lo-PRO®file, 526 | Bulk | Active | DIP, ZIF (ZIP) | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C | 0.105" (2.67mm) | UL94 V-0 | 3 A | - | |
| 28-526-11 | |||||||||||||||||||||||||||||
 | Mfr Part No.28-6574-16Internal Code270-409-1434178 | Aries Electronics |
CONN IC DIP SOCKET ZIF 28POS TIN
| Get a Quote | - | 57 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - | 0.110" (2.78mm) | UL94 V-0 | 1 A | - | ||
| 28-6574-16 | |||||||||||||||||||||||||||||
 | Mfr Part No.28-6574-10Internal Code270-409-1434176 | Aries Electronics |
CONN IC DIP SOCKET ZIF 28POS TIN
| Get a Quote | - | 57 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - | 0.110" (2.78mm) | UL94 V-0 | 1 A | - | ||
| 28-6574-10 | |||||||||||||||||||||||||||||
| | Mfr Part No.28-6573-11Internal Code270-409-1434173 | Aries Electronics |
CONN IC DIP SOCKET ZIF 28POS TIN
| Get a Quote | - | 57 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - | 0.110" (2.78mm) | UL94 V-0 | 1 A | - | ||
| 28-6573-11 | |||||||||||||||||||||||||||||
| | Mfr Part No.28-6571-16Internal Code270-409-1434166 | Aries Electronics |
CONN IC DIP SOCKET ZIF 28POS
| Get a Quote | - | 57 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Polyphenylene Sulfide (PPS), Glass Filled | - | 0.110" (2.78mm) | UL94 V-0 | 1 A | - | ||
| 28-6571-16 | |||||||||||||||||||||||||||||
| | Mfr Part No.28-6570-11Internal Code270-409-1434162 | Aries Electronics |
CONN IC DIP SOCKET ZIF 28POS GLD
| Get a Quote | - | 57 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - | 0.110" (2.78mm) | UL94 V-0 | 1 A | - | ||
| 28-6570-11 | |||||||||||||||||||||||||||||
 | Mfr Part No.28-6554-11Internal Code270-409-1434137 | Aries Electronics |
CONN IC DIP SOCKET ZIF 28POS GLD
| 211 Available |
|
Unit Price:
$15.833 Minimum: 1 Multiple: 1 | 55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - | 0.110" (2.78mm) | UL94 V-0 | 1 A | - | |
| 28-6554-11 | |||||||||||||||||||||||||||||
 | Mfr Part No.28-6554-10Internal Code270-409-1434136 | Aries Electronics |
CONN IC DIP SOCKET ZIF 28POS TIN
| 91 Available |
|
Unit Price:
$11.304 Minimum: 1 Multiple: 1 | 55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - | 0.110" (2.78mm) | UL94 V-0 | 1 A | - | |
| 28-6554-10 | |||||||||||||||||||||||||||||
| | Mfr Part No.28-6518-11Internal Code270-409-1434088 | Aries Electronics |
CONN IC DIP SOCKET 28POS GOLD
| Get a Quote | - | 518 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - | 0.125" (3.18mm) | UL94 V-0 | 3 A | - | ||
| 28-6518-11 | |||||||||||||||||||||||||||||
| | Mfr Part No.28-6518-10MInternal Code270-409-1434086 | Aries Electronics |
CONN IC DIP SOCKET 28POS GOLD
| Get a Quote | - | 518 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - | 0.125" (3.18mm) | UL94 V-0 | 3 A | - | ||
| 28-6518-10M | |||||||||||||||||||||||||||||
| | Mfr Part No.28-6513-10TInternal Code270-409-1434075 | Aries Electronics |
CONN IC DIP SOCKET 28POS GOLD
| Get a Quote | - | Lo-PRO®file, 513 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C | 0.125" (3.18mm) | UL94 V-0 | 3 A | - | ||
| 28-6513-10T | |||||||||||||||||||||||||||||
| | Mfr Part No.28-6513-10HInternal Code270-409-1434074 | Aries Electronics |
CONN IC DIP SOCKET 28POS GOLD
| Get a Quote | - | Lo-PRO®file, 513 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C | 0.125" (3.18mm) | UL94 V-0 | 3 A | - | ||
| 28-6513-10H | |||||||||||||||||||||||||||||
| | Mfr Part No.28-6513-10Internal Code270-409-1434073 | Aries Electronics |
CONN IC DIP SOCKET 28POS GOLD
| Get a Quote | - | Lo-PRO®file, 513 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C | 0.125" (3.18mm) | UL94 V-0 | 3 A | - | ||
| 28-6513-10 | |||||||||||||||||||||||||||||
| | Mfr Part No.28-6508-211Internal Code270-409-1434059 | Aries Electronics |
CONN IC DIP SOCKET 28POS GOLD
| Get a Quote | - | 508 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C | 0.500" (12.70mm) | UL94 V-0 | 3 A | - | ||
| 28-6508-211 | |||||||||||||||||||||||||||||
| | Mfr Part No.28-6503-31Internal Code270-409-1434049 | Aries Electronics |
CONN IC DIP SOCKET 28POS GOLD
| Get a Quote | - | 503 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C | 0.500" (12.70mm) | UL94 V-0 | 3 A | - | ||
| 28-6503-31 | |||||||||||||||||||||||||||||
| | Mfr Part No.28-6501-30Internal Code270-409-1434043 | Aries Electronics |
CONN IC DIP SOCKET 28POS TIN
| Get a Quote | - | 501 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C | 0.690" (17.52mm) | UL94 V-0 | 1.5 A | - | ||
| 28-6501-30 | |||||||||||||||||||||||||||||
| | Mfr Part No.28-6820-90CInternal Code270-409-1434402 | Aries Electronics |
CONN IC DIP SOCKET 28POS GOLD
| Get a Quote | - | Vertisockets™ 800 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C | 0.140" (3.56mm) | UL94 V-0 | 3 A | - | ||
| 28-6820-90C | |||||||||||||||||||||||||||||
| | Mfr Part No.28-6822-90CInternal Code270-409-1434404 | Aries Electronics |
CONN IC DIP SOCKET 28POS GOLD
| Get a Quote | - | Vertisockets™ 800 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C | 0.140" (3.56mm) | UL94 V-0 | 3 A | - | ||
| 28-6822-90C | |||||||||||||||||||||||||||||
 | Mfr Part No.28-823-90CInternal Code270-409-1435136 | Aries Electronics |
CONN IC DIP SOCKET 28POS GOLD
| 8 Available |
|
Unit Price:
$11.76 Minimum: 1 Multiple: 1 | Vertisockets™ 800 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C | 0.140" (3.56mm) | UL94 V-0 | 3 A | - | |
| 28-823-90C | |||||||||||||||||||||||||||||
| | Mfr Part No.28-8675-610CInternal Code270-409-1435325 | Aries Electronics |
CONN IC DIP SOCKET 28POS GOLD
| Get a Quote | - | 8 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C | 0.140" (3.56mm) | UL94 V-0 | 3 A | - | ||
| 28-8675-610C |