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4,290 results | remaining
Compare Image Part No Manufacturer Description Inventory Pricing Quantity SeriesPackagingPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating TemperatureTermination Post LengthMaterial Flammability RatingCurrent Rating (Amps)Contact Resistance
Compare Image Part No Manufacturer Description Inventory Pricing Quantity SeriesPackagingPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating TemperatureTermination Post LengthMaterial Flammability RatingCurrent Rating (Amps)Contact Resistance
28-8495-610C

Mfr Part No.

28-8495-610C

Internal Code

270-409-1435236
Aries Electronics
CONN IC DIP SOCKET 28POS GOLD
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8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C 0.140" (3.56mm) UL94 V-0 3 A -
28-8495-610C
28-8495-610C

270-409-1435236 Aries Electronics
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Package: -
Inventory: -
1 : -
28-8472-610C

Mfr Part No.

28-8472-610C

Internal Code

270-409-1435228
Aries Electronics
CONN IC DIP SOCKET 28POS GOLD
Get a Quote -
8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C 0.140" (3.56mm) UL94 V-0 3 A -
28-8472-610C
28-8472-610C

270-409-1435228 Aries Electronics
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Package: -
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28-C182-30

Mfr Part No.

28-C182-30

Internal Code

270-409-1436666
Aries Electronics
CONN IC DIP SOCKET 28POS GOLD
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EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C 0.040" (1.02mm) UL94 V-0 3 A -
28-C182-30
28-C182-30

270-409-1436666 Aries Electronics
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Package: -
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1 : -
28-C212-11

Mfr Part No.

28-C212-11

Internal Code

270-409-1436671
Aries Electronics
CONN IC DIP SOCKET 28POS GOLD
Get a Quote -
EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C 0.125" (3.18mm) UL94 V-0 3 A -
28-C212-11
28-C212-11

270-409-1436671 Aries Electronics
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Package: -
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28-PGM06002-10

Mfr Part No.

28-PGM06002-10

Internal Code

270-409-1437020
Aries Electronics
CONN SOCKET PGA GOLD
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PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C 0.165" (4.19mm) UL94 V-0 3 A -
28-PGM06002-10
28-PGM06002-10

270-409-1437020 Aries Electronics
RoHS :
Package: -
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1 : -
29-0501-31

Mfr Part No.

29-0501-31

Internal Code

270-409-1439064
Aries Electronics
CONN SOCKET SIP 29POS GOLD
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501 Bulk Active SIP 29 (1 x 29) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C 0.690" (17.52mm) UL94 V-0 1 A -
29-0501-31
29-0501-31

270-409-1439064 Aries Electronics
RoHS :
Package: -
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1 : -
29-0518-10

Mfr Part No.

29-0518-10

Internal Code

270-409-1439118
Aries Electronics
CONN SOCKET SIP 29POS GOLD
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518 Bulk Active SIP 29 (1 x 29) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled - 0.125" (3.18mm) UL94 V-0 3 A -
29-0518-10
29-0518-10

270-409-1439118 Aries Electronics
RoHS :
Package: -
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1 : -
29-0518-11

Mfr Part No.

29-0518-11

Internal Code

270-409-1439121
Aries Electronics
CONN SOCKET SIP 29POS GOLD
Get a Quote -
518 Bulk Active SIP 29 (1 x 29) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled - 0.125" (3.18mm) UL94 V-0 3 A -
29-0518-11
29-0518-11

270-409-1439121 Aries Electronics
RoHS :
Package: -
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1 : -
29-71250-10

Mfr Part No.

29-71250-10

Internal Code

270-409-1445110
Aries Electronics
CONN SOCKET SIP 29POS TIN
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700 Elevator Strip-Line™ Bulk Active SIP 29 (1 x 29) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C 0.150" (3.81mm) UL94 V-0 1.5 A -
29-71250-10
29-71250-10

270-409-1445110 Aries Electronics
RoHS :
Package: -
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1 : -
29-7625-10

Mfr Part No.

29-7625-10

Internal Code

270-409-1445196
Aries Electronics
CONN SOCKET SIP 29POS TIN
Get a Quote -
700 Elevator Strip-Line™ Bulk Active SIP 29 (1 x 29) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C 0.150" (3.81mm) UL94 V-0 1.5 A -
29-7625-10
29-7625-10

270-409-1445196 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
30-0501-31

Mfr Part No.

30-0501-31

Internal Code

270-409-1479396
Aries Electronics
CONN SOCKET SIP 30POS GOLD
Get a Quote -
501 Bulk Active SIP 30 (1 x 30) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C 0.690" (17.52mm) UL94 V-0 1 A -
30-0501-31
30-0501-31

270-409-1479396 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
30-0508-31

Mfr Part No.

30-0508-31

Internal Code

270-409-1479417
Aries Electronics
CONN SOCKET SIP 30POS GOLD
Get a Quote -
508 Bulk Active SIP 30 (1 x 30) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C 0.500" (12.70mm) UL94 V-0 3 A -
30-0508-31
30-0508-31

270-409-1479417 Aries Electronics
RoHS :
Package: -
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1 : -
300-PLS20006-12

Mfr Part No.

300-PLS20006-12

Internal Code

270-409-1480827
Aries Electronics
CONN SOCKET PGA ZIF GOLD
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PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C 0.125" (3.18mm) UL94 V-0 1 A -
300-PLS20006-12
300-PLS20006-12

270-409-1480827 Aries Electronics
RoHS :
Package: -
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1 : -
30-1508-31

Mfr Part No.

30-1508-31

Internal Code

270-409-1482214
Aries Electronics
CONN IC DIP SOCKET 30POS GOLD
Get a Quote -
508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C 0.500" (12.70mm) UL94 V-0 3 A -
30-1508-31
30-1508-31

270-409-1482214 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
30-1518-10H

Mfr Part No.

30-1518-10H

Internal Code

270-409-1482224
Aries Electronics
CONN IC DIP SOCKET 30POS GOLD
Get a Quote -
518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled - 0.125" (3.18mm) UL94 V-0 3 A -
30-1518-10H
30-1518-10H

270-409-1482224 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
30-3513-10H

Mfr Part No.

30-3513-10H

Internal Code

270-409-1487890
Aries Electronics
CONN IC DIP SOCKET 30POS GOLD
Get a Quote -
Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C 0.125" (3.18mm) UL94 V-0 3 A -
30-3513-10H
30-3513-10H

270-409-1487890 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
30-3513-11H

Mfr Part No.

30-3513-11H

Internal Code

270-409-1487893
Aries Electronics
CONN IC DIP SOCKET 30POS GOLD
Get a Quote -
Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C 0.125" (3.18mm) UL94 V-0 3 A -
30-3513-11H
30-3513-11H

270-409-1487893 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
30-6501-30

Mfr Part No.

30-6501-30

Internal Code

270-409-1503549
Aries Electronics
CONN IC DIP SOCKET 30POS TIN
Get a Quote -
501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C 0.690" (17.52mm) UL94 V-0 1.5 A -
30-6501-30
30-6501-30

270-409-1503549 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
30-6503-20

Mfr Part No.

30-6503-20

Internal Code

270-409-1503551
Aries Electronics
CONN IC DIP SOCKET 30POS GOLD
Get a Quote -
503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C 0.360" (9.14mm) UL94 V-0 3 A -
30-6503-20
30-6503-20

270-409-1503551 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
30-6503-31

Mfr Part No.

30-6503-31

Internal Code

270-409-1503554
Aries Electronics
CONN IC DIP SOCKET 30POS GOLD
Get a Quote -
503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C 0.500" (12.70mm) UL94 V-0 3 A -
30-6503-31
30-6503-31

270-409-1503554 Aries Electronics
RoHS :
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