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| Compare | Image | Part No | Manufacturer | Description | Inventory | Pricing | Quantity | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature | Termination Post Length | Material Flammability Rating | Current Rating (Amps) | Contact Resistance |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No.18-3513-00Internal Code270-409-1031648 | Aries Electronics |
CONN IC DIP SOCKET 18POS GOLD
| Get a Quote | - | Lo-PRO®file, 513 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C | 0.125" (3.18mm) | UL94 V-0 | 3 A | - | ||
| 18-3513-00 | |||||||||||||||||||||||||||||
| | Mfr Part No.18-3513-10TInternal Code270-409-1031652 | Aries Electronics |
CONN IC DIP SOCKET 18POS GOLD
| Get a Quote | - | Lo-PRO®file, 513 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C | 0.125" (3.18mm) | UL94 V-0 | 3 A | - | ||
| 18-3513-10T | |||||||||||||||||||||||||||||
| | Mfr Part No.18-3518-102Internal Code270-409-1031666 | Aries Electronics |
CONN IC DIP SOCKET 18POS GOLD
| Get a Quote | - | 518 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - | 0.125" (3.18mm) | UL94 V-0 | 3 A | - | ||
| 18-3518-102 | |||||||||||||||||||||||||||||
| | Mfr Part No.18-6513-10TInternal Code270-409-1041267 | Aries Electronics |
CONN IC DIP SOCKET 18POS GOLD
| Get a Quote | - | Lo-PRO®file, 513 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C | 0.125" (3.18mm) | UL94 V-0 | 3 A | - | ||
| 18-6513-10T | |||||||||||||||||||||||||||||
 | Mfr Part No.18-6823-90Internal Code270-409-1041505 | Aries Electronics |
CONN IC DIP SOCKET 18POS GOLD
| Get a Quote | - | Vertisockets™ 800 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6 | - | 0.145" (3.68mm) | UL94 V-0 | 1.5 A | - | ||
| 18-6823-90 | |||||||||||||||||||||||||||||
| | Mfr Part No.18-6823-90TInternal Code270-409-1041507 | Aries Electronics |
CONN IC DIP SOCKET 18POS TIN
| Get a Quote | - | Vertisockets™ 800 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6 | -55°C ~ 105°C | 0.145" (3.68mm) | UL94 V-0 | 1.5 A | - | ||
| 18-6823-90T | |||||||||||||||||||||||||||||
| | Mfr Part No.18-68660-10Internal Code270-409-1041536 | Aries Electronics |
CONN IC DIP SOCKET 18POS TIN
| Get a Quote | - | 8 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C | 0.140" (3.56mm) | UL94 V-0 | 1 A | - | ||
| 18-68660-10 | |||||||||||||||||||||||||||||
| | Mfr Part No.18-7625-10Internal Code270-409-1043171 | Aries Electronics |
CONN SOCKET SIP 18POS TIN
| Get a Quote | - | 700 Elevator Strip-Line™ | Bulk | Active | SIP | 18 (1 x 18) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C | 0.150" (3.81mm) | UL94 V-0 | 1.5 A | - | ||
| 18-7625-10 | |||||||||||||||||||||||||||||
| | Mfr Part No.18-810-90TInternal Code270-409-1044362 | Aries Electronics |
CONN IC DIP SOCKET 18POS TIN
| Get a Quote | - | Vertisockets™ 800 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole, Right Angle, Vertical | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6 | - | 0.145" (3.68mm) | UL94 V-0 | 1.5 A | - | ||
| 18-810-90T | |||||||||||||||||||||||||||||
| | Mfr Part No.18-81125-610CInternal Code270-409-1044386 | Aries Electronics |
CONN IC DIP SOCKET 18POS GOLD
| Get a Quote | - | 8 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C | 0.140" (3.56mm) | UL94 V-0 | 3 A | - | ||
| 18-81125-610C | |||||||||||||||||||||||||||||
| | Mfr Part No.18-81240-610CInternal Code270-409-1044395 | Aries Electronics |
CONN IC DIP SOCKET 18POS GOLD
| Get a Quote | - | 8 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C | 0.140" (3.56mm) | UL94 V-0 | 3 A | - | ||
| 18-81240-610C | |||||||||||||||||||||||||||||
| | Mfr Part No.18-81250-310CInternal Code270-409-1044397 | Aries Electronics |
CONN IC DIP SOCKET 18POS GOLD
| Get a Quote | - | 8 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C | 0.140" (3.56mm) | UL94 V-0 | 3 A | - | ||
| 18-81250-310C | |||||||||||||||||||||||||||||
| | Mfr Part No.18-81250-610CInternal Code270-409-1044398 | Aries Electronics |
CONN IC DIP SOCKET 18POS GOLD
| Get a Quote | - | 8 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C | 0.140" (3.56mm) | UL94 V-0 | 3 A | - | ||
| 18-81250-610C | |||||||||||||||||||||||||||||
| | Mfr Part No.18-822-90CInternal Code270-409-1044573 | Aries Electronics |
CONN IC DIP SOCKET 18POS GOLD
| Get a Quote | - | Vertisockets™ 800 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C | 0.140" (3.56mm) | UL94 V-0 | 3 A | - | ||
| 18-822-90C | |||||||||||||||||||||||||||||
| | Mfr Part No.18-822-90EInternal Code270-409-1044574 | Aries Electronics |
CONN IC DIP SOCKET 18POS TIN
| Get a Quote | - | Vertisockets™ 800 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Tin | 50.0µin (1.27µm) | Phosphor Bronze | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 50.0µin (1.27µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6 | - | 0.150" (3.81mm) | UL94 V-0 | 1.5 A | - | ||
| 18-822-90E | |||||||||||||||||||||||||||||
| | Mfr Part No.18-8355-610CInternal Code270-409-1044816 | Aries Electronics |
CONN IC DIP SOCKET 18POS GOLD
| Get a Quote | - | 8 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C | 0.140" (3.56mm) | UL94 V-0 | 3 A | - | ||
| 18-8355-610C | |||||||||||||||||||||||||||||
| | Mfr Part No.18-8375-310CInternal Code270-409-1044870 | Aries Electronics |
CONN IC DIP SOCKET 18POS GOLD
| Get a Quote | - | 8 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C | 0.140" (3.56mm) | UL94 V-0 | 3 A | - | ||
| 18-8375-310C | |||||||||||||||||||||||||||||
 | Mfr Part No.18-8400-610CInternal Code270-409-1044975 | Aries Electronics |
CONN IC DIP SOCKET 18POS GOLD
| Get a Quote | - | 8 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C | 0.140" (3.56mm) | UL94 V-0 | 3 A | - | ||
| 18-8400-610C | |||||||||||||||||||||||||||||
| | Mfr Part No.18-8532-610CInternal Code270-409-1045227 | Aries Electronics |
CONN IC DIP SOCKET 18POS GOLD
| Get a Quote | - | 8 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C | 0.140" (3.56mm) | UL94 V-0 | 3 A | - | ||
| 18-8532-610C | |||||||||||||||||||||||||||||
| | Mfr Part No.18-8540-610CInternal Code270-409-1045241 | Aries Electronics |
CONN IC DIP SOCKET 18POS GOLD
| Get a Quote | - | 8 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C | 0.140" (3.56mm) | UL94 V-0 | 3 A | - | ||
| 18-8540-610C |