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Sockets for ICs, Transistors - IC Sockets

4,290 results

Compare	Part No	Manufacturer	Description	Inventory	Pricing	Series	Packaging	Part Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature	Termination Post Length	Material Flammability Rating	Current Rating (Amps)	Contact Resistance
	Mfr Part No. 16-0513-11 Internal Code 270-409-786794	Aries Electronics	CONN SOCKET SIP 16POS GOLD	Get a Quote	-	0513	Bulk	Active	SIP	16 (1 x 16)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-	0.125" (3.18mm)	UL94 V-0	3 A	-
16-0513-11 270-409-786794 Aries Electronics RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 16-1508-31 Internal Code 270-409-790287	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD	Get a Quote	-	508	Bulk	Active	DIP, 0.2" (5.08mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6	-55°C ~ 125°C	0.500" (12.70mm)	UL94 V-0	3 A	-
16-1508-31 270-409-790287 Aries Electronics RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 16-1518-11 Internal Code 270-409-790298	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD	Get a Quote	-	518	Bulk	Active	DIP, 0.2" (5.08mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-	0.125" (3.18mm)	UL94 V-0	3 A	-
16-1518-11 270-409-790298 Aries Electronics RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 16-3518-101 Internal Code 270-409-798448	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD	Get a Quote	-	518	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-	0.125" (3.18mm)	UL94 V-0	3 A	-
16-3518-101 270-409-798448 Aries Electronics RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 16-3518-11H Internal Code 270-409-798458	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD	Get a Quote	-	518	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-	0.125" (3.18mm)	UL94 V-0	3 A	-
16-3518-11H 270-409-798458 Aries Electronics RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 16-3508-21 Internal Code 270-409-798418	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD	Get a Quote	-	508	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C	0.500" (12.70mm)	UL94 V-0	3 A	-
16-3508-21 270-409-798418 Aries Electronics RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 16-3503-31 Internal Code 270-409-798412	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD	Get a Quote	-	503	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C	0.500" (12.70mm)	UL94 V-0	3 A	-
16-3503-31 270-409-798412 Aries Electronics RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 16-3503-30 Internal Code 270-409-798411	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD	Get a Quote	-	503	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C	0.500" (12.70mm)	UL94 V-0	3 A	-
16-3503-30 270-409-798411 Aries Electronics RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 16-3503-21 Internal Code 270-409-798410	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD	Get a Quote	-	503	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C	0.360" (9.14mm)	UL94 V-0	3 A	-
16-3503-21 270-409-798410 Aries Electronics RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 16-3501-31 Internal Code 270-409-798408	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD	Get a Quote	-	501	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C	0.690" (17.52mm)	UL94 V-0	1.5 A	-
16-3501-31 270-409-798408 Aries Electronics RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 163-PRS15065-12 Internal Code 270-409-799839	Aries Electronics	CONN SOCKET PGA ZIF GOLD	Get a Quote	-	PRS	Bulk	Active	PGA, ZIF (ZIP)	-	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)	-65°C ~ 125°C	0.125" (3.18mm)	UL94 V-0	1 A	-
163-PRS15065-12 270-409-799839 Aries Electronics RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 16-4820-90C Internal Code 270-409-802506	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD	Get a Quote	-	Vertisockets™ 800	Bulk	Active	DIP, 0.4" (10.16mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C	0.140" (3.56mm)	UL94 V-0	3 A	-
16-4820-90C 270-409-802506 Aries Electronics RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 16-6501-31 Internal Code 270-409-807281	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD	Get a Quote	-	501	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C	0.690" (17.52mm)	UL94 V-0	1.5 A	-
16-6501-31 270-409-807281 Aries Electronics RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 16-6810-90 Internal Code 270-409-807550	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD	Get a Quote	-	Vertisockets™ 800	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole, Right Angle, Vertical	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6	-	0.145" (3.68mm)	UL94 V-0	1.5 A	-
16-6810-90 270-409-807550 Aries Electronics RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 16-6823-90 Internal Code 270-409-807570	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD	Get a Quote	-	Vertisockets™ 800	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6	-	0.145" (3.68mm)	UL94 V-0	1.5 A	-
16-6823-90 270-409-807570 Aries Electronics RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 16-6823-90T Internal Code 270-409-807572	Aries Electronics	CONN IC DIP SOCKET 16POS TIN	Get a Quote	-	Vertisockets™ 800	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6	-	0.145" (3.68mm)	UL94 V-0	1.5 A	-
16-6823-90T 270-409-807572 Aries Electronics RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 16-71000-10 Internal Code 270-409-808392	Aries Electronics	CONN SOCKET SIP 16POS TIN	Get a Quote	-	700 Elevator Strip-Line™	Bulk	Active	SIP	16 (1 x 16)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C	0.150" (3.81mm)	UL94 V-0	1.5 A	-
16-71000-10 270-409-808392 Aries Electronics RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 16-7440-10 Internal Code 270-409-809084	Aries Electronics	CONN SOCKET SIP 16POS TIN	Get a Quote	-	700 Elevator Strip-Line™	Bulk	Active	SIP	16 (1 x 16)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C	0.150" (3.81mm)	UL94 V-0	1.5 A	-
16-7440-10 270-409-809084 Aries Electronics RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 16-820-90 Internal Code 270-409-810473	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD	Get a Quote	-	Vertisockets™ 800	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6	-	0.145" (3.68mm)	UL94 V-0	1.5 A	-
16-820-90 270-409-810473 Aries Electronics RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 16-820-90CTL Internal Code 270-409-810476	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD	Get a Quote	-	Vertisockets™ 800	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C	0.140" (3.56mm)	UL94 V-0	3 A	-
16-820-90CTL 270-409-810476 Aries Electronics RoHS : Package: - Inventory: - 1 : -

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