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4,290 results | remaining
Compare Image Part No Manufacturer Description Inventory Pricing Quantity SeriesPackagingPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating TemperatureTermination Post LengthMaterial Flammability RatingCurrent Rating (Amps)Contact Resistance
Compare Image Part No Manufacturer Description Inventory Pricing Quantity SeriesPackagingPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating TemperatureTermination Post LengthMaterial Flammability RatingCurrent Rating (Amps)Contact Resistance
10-6823-90T

Mfr Part No.

10-6823-90T

Internal Code

270-409-404726
Aries Electronics
CONN IC DIP SOCKET 10POS TIN
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Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 - 0.145" (3.68mm) UL94 V-0 1.5 A -
10-6823-90T
10-6823-90T

270-409-404726 Aries Electronics
RoHS :
Package: -
Inventory: -
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10-6823-90TWR

Mfr Part No.

10-6823-90TWR

Internal Code

270-409-404727
Aries Electronics
CONN IC DIP SOCKET 10POS TIN
Get a Quote -
Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 - 0.145" (3.68mm) UL94 V-0 1.5 A -
10-6823-90TWR
10-6823-90TWR

270-409-404727 Aries Electronics
RoHS :
Package: -
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1 : -
10-71250-10

Mfr Part No.

10-71250-10

Internal Code

270-409-405600
Aries Electronics
CONN SOCKET SIP 10POS TIN
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700 Elevator Strip-Line™ Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C 0.150" (3.81mm) UL94 V-0 1.5 A -
10-71250-10
10-71250-10

270-409-405600 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
10-7410-10

Mfr Part No.

10-7410-10

Internal Code

270-409-406098
Aries Electronics
CONN SOCKET SIP 10POS TIN
Get a Quote -
700 Elevator Strip-Line™ Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C 0.150" (3.81mm) UL94 V-0 1.5 A -
10-7410-10
10-7410-10

270-409-406098 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
10-7560-10

Mfr Part No.

10-7560-10

Internal Code

270-409-406240
Aries Electronics
CONN SOCKET SIP 10POS TIN
Get a Quote -
700 Elevator Strip-Line™ Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C 0.150" (3.81mm) UL94 V-0 1.5 A -
10-7560-10
10-7560-10

270-409-406240 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
10-822-90C

Mfr Part No.

10-822-90C

Internal Code

270-409-407453
Aries Electronics
CONN IC DIP SOCKET 10POS GOLD
Get a Quote -
Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C 0.140" (3.56mm) UL94 V-0 3 A -
10-822-90C
10-822-90C

270-409-407453 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
10-8270-310C

Mfr Part No.

10-8270-310C

Internal Code

270-409-407615
Aries Electronics
CONN IC DIP SOCKET 10POS GOLD
Get a Quote -
8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C 0.140" (3.56mm) UL94 V-0 3 A -
10-8270-310C
10-8270-310C

270-409-407615 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
10-8350-210C

Mfr Part No.

10-8350-210C

Internal Code

270-409-407852
Aries Electronics
CONN IC DIP SOCKET 10POS GOLD
Get a Quote -
8 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C 0.140" (3.56mm) UL94 V-0 3 A -
10-8350-210C
10-8350-210C

270-409-407852 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
10-8470-610C

Mfr Part No.

10-8470-610C

Internal Code

270-409-408137
Aries Electronics
CONN IC DIP SOCKET 10POS GOLD
Get a Quote -
8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C 0.140" (3.56mm) UL94 V-0 3 A -
10-8470-610C
10-8470-610C

270-409-408137 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
10-8545-610C

Mfr Part No.

10-8545-610C

Internal Code

270-409-408352
Aries Electronics
CONN IC DIP SOCKET 10POS GOLD
Get a Quote -
8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C 0.140" (3.56mm) UL94 V-0 3 A -
10-8545-610C
10-8545-610C

270-409-408352 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
10-8620-210C

Mfr Part No.

10-8620-210C

Internal Code

270-409-408460
Aries Electronics
CONN IC DIP SOCKET 10POS GOLD
Get a Quote -
8 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C 0.140" (3.56mm) UL94 V-0 3 A -
10-8620-210C
10-8620-210C

270-409-408460 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
10-8620-310C

Mfr Part No.

10-8620-310C

Internal Code

270-409-408461
Aries Electronics
CONN IC DIP SOCKET 10POS GOLD
Get a Quote -
8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C 0.140" (3.56mm) UL94 V-0 3 A -
10-8620-310C
10-8620-310C

270-409-408461 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
10-8630-310C

Mfr Part No.

10-8630-310C

Internal Code

270-409-408478
Aries Electronics
CONN IC DIP SOCKET 10POS GOLD
Get a Quote -
8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C 0.140" (3.56mm) UL94 V-0 3 A -
10-8630-310C
10-8630-310C

270-409-408478 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
10-8723-210C

Mfr Part No.

10-8723-210C

Internal Code

270-409-408637
Aries Electronics
CONN IC DIP SOCKET 10POS GOLD
Get a Quote -
8 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C 0.140" (3.56mm) UL94 V-0 3 A -
10-8723-210C
10-8723-210C

270-409-408637 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
10-8800-210C

Mfr Part No.

10-8800-210C

Internal Code

270-409-408691
Aries Electronics
CONN IC DIP SOCKET 10POS GOLD
Get a Quote -
8 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C 0.140" (3.56mm) UL94 V-0 3 A -
10-8800-210C
10-8800-210C

270-409-408691 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
10-8875-210C

Mfr Part No.

10-8875-210C

Internal Code

270-409-408912
Aries Electronics
CONN IC DIP SOCKET 10POS GOLD
Get a Quote -
8 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C 0.140" (3.56mm) UL94 V-0 3 A -
10-8875-210C
10-8875-210C

270-409-408912 Aries Electronics
RoHS :
Package: -
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1 : -
108-PGM12005-10

Mfr Part No.

108-PGM12005-10

Internal Code

270-409-409275
Aries Electronics
CONN SOCKET PGA GOLD
Get a Quote -
PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C 0.165" (4.19mm) UL94 V-0 3 A -
108-PGM12005-10
108-PGM12005-10

270-409-409275 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
108-PLS12024-12

Mfr Part No.

108-PLS12024-12

Internal Code

270-409-409278
Aries Electronics
CONN SOCKET PGA ZIF GOLD
Get a Quote -
PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C 0.125" (3.18mm) UL94 V-0 1 A -
108-PLS12024-12
108-PLS12024-12

270-409-409278 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
108-PRS13129-12

Mfr Part No.

108-PRS13129-12

Internal Code

270-409-409281
Aries Electronics
CONN SOCKET PGA ZIF GOLD
Get a Quote -
PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C 0.125" (3.18mm) UL94 V-0 1 A -
108-PRS13129-12
108-PRS13129-12

270-409-409281 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
10-9513-10

Mfr Part No.

10-9513-10

Internal Code

270-409-410383
Aries Electronics
CONN IC DIP SOCKET 10POS GOLD
Get a Quote -
Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C 0.125" (3.18mm) UL94 V-0 3 A -
10-9513-10
10-9513-10

270-409-410383 Aries Electronics
RoHS :
Package: -
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