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4,290 results | remaining
Compare Image Part No Manufacturer Description Inventory Pricing Quantity SeriesPackagingPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating TemperatureTermination Post LengthMaterial Flammability RatingCurrent Rating (Amps)Contact Resistance
Compare Image Part No Manufacturer Description Inventory Pricing Quantity SeriesPackagingPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating TemperatureTermination Post LengthMaterial Flammability RatingCurrent Rating (Amps)Contact Resistance
44-3551-10

Mfr Part No.

44-3551-10

Internal Code

270-409-2085576
Aries Electronics
CONN IC DIP SOCKET ZIF 44POS TIN
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55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled - 0.110" (2.78mm) UL94 V-0 1 A -
44-3551-10
44-3551-10

270-409-2085576 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
44-3551-16

Mfr Part No.

44-3551-16

Internal Code

270-409-2085578
Aries Electronics
CONN IC DIP SOCKET ZIF 44POS
Get a Quote -
55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled - 0.110" (2.78mm) UL94 V-0 1 A -
44-3551-16
44-3551-16

270-409-2085578 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
44-3570-10

Mfr Part No.

44-3570-10

Internal Code

270-409-2085599
Aries Electronics
CONN IC DIP SOCKET ZIF 44POS TIN
Get a Quote -
57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled - 0.110" (2.78mm) UL94 V-0 1 A -
44-3570-10
44-3570-10

270-409-2085599 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
44-3572-10

Mfr Part No.

44-3572-10

Internal Code

270-409-2085605
Aries Electronics
CONN IC DIP SOCKET ZIF 44POS TIN
Get a Quote -
57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled - 0.110" (2.78mm) UL94 V-0 1 A -
44-3572-10
44-3572-10

270-409-2085605 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
44-3572-16

Mfr Part No.

44-3572-16

Internal Code

270-409-2085607
Aries Electronics
CONN IC DIP SOCKET ZIF 44POS
Get a Quote -
57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled - 0.110" (2.78mm) UL94 V-0 1 A -
44-3572-16
44-3572-16

270-409-2085607 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
44-3575-10

Mfr Part No.

44-3575-10

Internal Code

270-409-2085615
Aries Electronics
CONN IC DIP SOCKET ZIF 44POS TIN
Get a Quote -
57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled - 0.110" (2.78mm) UL94 V-0 1 A -
44-3575-10
44-3575-10

270-409-2085615 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
44-547-11E

Mfr Part No.

44-547-11E

Internal Code

270-409-2086690
Aries Electronics
CONN SOCKET SOIC ZIF 44POS GOLD
9 Available
  • 1 : $183.96
  • 10 : $177.91103
  • 25 : $176.6743
  • 50 : $175.44619
  • 100 : $171.83759
  • 500 : $168.96519
Unit Price: $183.96
Minimum: 1 Multiple: 1
547 Bulk Active SOIC, ZIF (ZIP) 44 (2 x 22) - Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 20.0µin (0.51µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled - 0.150" (3.81mm) UL94 V-0 1 A -
44-547-11E
44-547-11E

270-409-2086690 Aries Electronics
RoHS :
Package: -
Inventory: 9
1 : $183.96
44-6551-16

Mfr Part No.

44-6551-16

Internal Code

270-409-2090499
Aries Electronics
CONN IC DIP SOCKET ZIF 44POS
Get a Quote -
55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled - 0.110" (2.78mm) UL94 V-0 1 A -
44-6551-16
44-6551-16

270-409-2090499 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
44-6553-11

Mfr Part No.

44-6553-11

Internal Code

270-409-2090506
Aries Electronics
CONN IC DIP SOCKET ZIF 44POS GLD
Get a Quote -
55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled - 0.110" (2.78mm) UL94 V-0 1 A -
44-6553-11
44-6553-11

270-409-2090506 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
44-6556-10

Mfr Part No.

44-6556-10

Internal Code

270-409-2090513
Aries Electronics
CONN IC DIP SOCKET 44POS GOLD
Get a Quote -
6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled - 0.130" (3.30mm) UL94 V-0 3 A -
44-6556-10
44-6556-10

270-409-2090513 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
44-6556-21

Mfr Part No.

44-6556-21

Internal Code

270-409-2090516
Aries Electronics
CONN IC DIP SOCKET 44POS GOLD
Get a Quote -
6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled - 0.283" (7.19mm) UL94 V-0 3 A -
44-6556-21
44-6556-21

270-409-2090516 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
44-6556-31

Mfr Part No.

44-6556-31

Internal Code

270-409-2090518
Aries Electronics
CONN IC DIP SOCKET 44POS GOLD
Get a Quote -
6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled - 0.423" (10.74mm) UL94 V-0 3 A -
44-6556-31
44-6556-31

270-409-2090518 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
44-6571-10

Mfr Part No.

44-6571-10

Internal Code

270-409-2090524
Aries Electronics
CONN IC DIP SOCKET ZIF 44POS TIN
Get a Quote -
57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled - 0.110" (2.78mm) UL94 V-0 1 A -
44-6571-10
44-6571-10

270-409-2090524 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
44-6572-11

Mfr Part No.

44-6572-11

Internal Code

270-409-2090528
Aries Electronics
CONN IC DIP SOCKET ZIF 44POS TIN
Get a Quote -
57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled - 0.110" (2.78mm) UL94 V-0 1 A -
44-6572-11
44-6572-11

270-409-2090528 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
44-6574-10

Mfr Part No.

44-6574-10

Internal Code

270-409-2090533
Aries Electronics
CONN IC DIP SOCKET ZIF 44POS TIN
Get a Quote -
57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled - 0.110" (2.78mm) UL94 V-0 1 A -
44-6574-10
44-6574-10

270-409-2090533 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
44-6574-16

Mfr Part No.

44-6574-16

Internal Code

270-409-2090535
Aries Electronics
CONN IC DIP SOCKET ZIF 44POS TIN
Get a Quote -
57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled - 0.110" (2.78mm) UL94 V-0 1 A -
44-6574-16
44-6574-16

270-409-2090535 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
44-6575-11

Mfr Part No.

44-6575-11

Internal Code

270-409-2090538
Aries Electronics
CONN IC DIP SOCKET ZIF 44POS TIN
Get a Quote -
57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled - 0.110" (2.78mm) UL94 V-0 1 A -
44-6575-11
44-6575-11

270-409-2090538 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
44-PRS12017-12

Mfr Part No.

44-PRS12017-12

Internal Code

270-409-2098784
Aries Electronics
CONN SOCKET PGA ZIF GOLD
Get a Quote -
PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C 0.125" (3.18mm) UL94 V-0 1 A -
44-PRS12017-12
44-PRS12017-12

270-409-2098784 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
48-3551-16

Mfr Part No.

48-3551-16

Internal Code

270-409-2139545
Aries Electronics
CONN IC DIP SOCKET ZIF 48POS
Get a Quote -
55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled - 0.110" (2.78mm) UL94 V-0 1 A -
48-3551-16
48-3551-16

270-409-2139545 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
48-3552-11

Mfr Part No.

48-3552-11

Internal Code

270-409-2139548
Aries Electronics
CONN IC DIP SOCKET ZIF 48POS GLD
Get a Quote -
55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled - 0.110" (2.78mm) UL94 V-0 1 A -
48-3552-11
48-3552-11

270-409-2139548 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
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