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4,290 results | remaining
Compare Image Part No Manufacturer Description Inventory Pricing Quantity SeriesPackagingPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating TemperatureTermination Post LengthMaterial Flammability RatingCurrent Rating (Amps)Contact Resistance
Compare Image Part No Manufacturer Description Inventory Pricing Quantity SeriesPackagingPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating TemperatureTermination Post LengthMaterial Flammability RatingCurrent Rating (Amps)Contact Resistance
48-3554-16

Mfr Part No.

48-3554-16

Internal Code

270-409-2139557
Aries Electronics
CONN IC DIP SOCKET ZIF 48POS
Get a Quote -
55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled - 0.110" (2.78mm) UL94 V-0 1 A -
48-3554-16
48-3554-16

270-409-2139557 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
48-3570-16

Mfr Part No.

48-3570-16

Internal Code

270-409-2139561
Aries Electronics
CONN IC DIP SOCKET ZIF 48POS
Get a Quote -
57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled - 0.110" (2.78mm) UL94 V-0 1 A -
48-3570-16
48-3570-16

270-409-2139561 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
48-3572-16

Mfr Part No.

48-3572-16

Internal Code

270-409-2139567
Aries Electronics
CONN IC DIP SOCKET ZIF 48POS
Get a Quote -
57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled - 0.110" (2.78mm) UL94 V-0 1 A -
48-3572-16
48-3572-16

270-409-2139567 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
48-3574-11

Mfr Part No.

48-3574-11

Internal Code

270-409-2139572
Aries Electronics
CONN IC DIP SOCKET ZIF 48POS TIN
Get a Quote -
57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled - 0.110" (2.78mm) UL94 V-0 1 A -
48-3574-11
48-3574-11

270-409-2139572 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
48-3575-10

Mfr Part No.

48-3575-10

Internal Code

270-409-2139575
Aries Electronics
CONN IC DIP SOCKET ZIF 48POS TIN
Get a Quote -
57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled - 0.110" (2.78mm) UL94 V-0 1 A -
48-3575-10
48-3575-10

270-409-2139575 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
48-3575-16

Mfr Part No.

48-3575-16

Internal Code

270-409-2139577
Aries Electronics
CONN IC DIP SOCKET ZIF 48POS TIN
Get a Quote -
57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled - 0.110" (2.78mm) UL94 V-0 1 A -
48-3575-16
48-3575-16

270-409-2139577 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
48-6503-20

Mfr Part No.

48-6503-20

Internal Code

270-409-2140427
Aries Electronics
CONN IC DIP SOCKET 48POS GOLD
Get a Quote -
503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C 0.360" (9.14mm) UL94 V-0 3 A -
48-6503-20
48-6503-20

270-409-2140427 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
48-6503-30

Mfr Part No.

48-6503-30

Internal Code

270-409-2140429
Aries Electronics
CONN IC DIP SOCKET 48POS GOLD
Get a Quote -
503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C 0.500" (12.70mm) UL94 V-0 3 A -
48-6503-30
48-6503-30

270-409-2140429 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
48-6508-20

Mfr Part No.

48-6508-20

Internal Code

270-409-2140431
Aries Electronics
CONN IC DIP SOCKET 48POS GOLD
Get a Quote -
508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C 0.360" (9.14mm) UL94 V-0 3 A -
48-6508-20
48-6508-20

270-409-2140431 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
48-6508-21

Mfr Part No.

48-6508-21

Internal Code

270-409-2140432
Aries Electronics
CONN IC DIP SOCKET 48POS GOLD
Get a Quote -
508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C 0.360" (9.14mm) UL94 V-0 3 A -
48-6508-21
48-6508-21

270-409-2140432 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
48-6508-31

Mfr Part No.

48-6508-31

Internal Code

270-409-2140434
Aries Electronics
CONN IC DIP SOCKET 48POS GOLD
Get a Quote -
508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C 0.500" (12.70mm) UL94 V-0 3 A -
48-6508-31
48-6508-31

270-409-2140434 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
48-6518-11

Mfr Part No.

48-6518-11

Internal Code

270-409-2140448
Aries Electronics
CONN IC DIP SOCKET 48POS GOLD
Get a Quote -
518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled - 0.125" (3.18mm) UL94 V-0 3 A -
48-6518-11
48-6518-11

270-409-2140448 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
48-6551-11

Mfr Part No.

48-6551-11

Internal Code

270-409-2140454
Aries Electronics
CONN IC DIP SOCKET ZIF 48POS GLD
Get a Quote -
55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled - 0.110" (2.78mm) UL94 V-0 1 A -
48-6551-11
48-6551-11

270-409-2140454 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
48-6552-10

Mfr Part No.

48-6552-10

Internal Code

270-409-2140456
Aries Electronics
CONN IC DIP SOCKET ZIF 48POS TIN
Get a Quote -
55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled - 0.110" (2.78mm) UL94 V-0 1 A -
48-6552-10
48-6552-10

270-409-2140456 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
48-6552-11

Mfr Part No.

48-6552-11

Internal Code

270-409-2140457
Aries Electronics
CONN IC DIP SOCKET ZIF 48POS GLD
Get a Quote -
55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled - 0.110" (2.78mm) UL94 V-0 1 A -
48-6552-11
48-6552-11

270-409-2140457 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
48-6553-10

Mfr Part No.

48-6553-10

Internal Code

270-409-2140460
Aries Electronics
CONN IC DIP SOCKET ZIF 48POS TIN
Get a Quote -
55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled - 0.110" (2.78mm) UL94 V-0 1 A -
48-6553-10
48-6553-10

270-409-2140460 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
48-6553-18

Mfr Part No.

48-6553-18

Internal Code

270-409-2140463
Aries Electronics
CONN IC DIP SOCKET ZIF 48POS
Get a Quote -
55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C 0.110" (2.78mm) UL94 V-0 1 A -
48-6553-18
48-6553-18

270-409-2140463 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
48-6554-11

Mfr Part No.

48-6554-11

Internal Code

270-409-2140465
Aries Electronics
CONN IC DIP SOCKET ZIF 48POS GLD
58 Available
  • 1 : $26.584
  • 10 : $24.16727
  • 100 : $22.17181
  • 500 : $20.52946
  • 1000 : $19.18641
  • 3000 : $18.10039
Unit Price: $26.584
Minimum: 1 Multiple: 1
55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled - 0.110" (2.78mm) UL94 V-0 1 A -
48-6554-11
48-6554-11

270-409-2140465 Aries Electronics
RoHS :
Package: -
Inventory: 58
1 : $26.584
48-6570-10

Mfr Part No.

48-6570-10

Internal Code

270-409-2140476
Aries Electronics
CONN IC DIP SOCKET ZIF 48POS TIN
Get a Quote -
57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled - 0.110" (2.78mm) UL94 V-0 1 A -
48-6570-10
48-6570-10

270-409-2140476 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
48-6573-11

Mfr Part No.

48-6573-11

Internal Code

270-409-2140487
Aries Electronics
CONN IC DIP SOCKET ZIF 48POS GLD
Get a Quote -
57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled - 0.110" (2.78mm) UL94 V-0 1 A -
48-6573-11
48-6573-11

270-409-2140487 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
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