Ansinor parts stores,electronic components,electronic parts,electronics parts supply

Sign In
My Cart
All Products All Products Manufacturers Manufacturers RFQ Community Tools About Us About Us
  • All Products
  • Connectors, Interconnects
  • Sockets for ICs, Transistors - IC Sockets
4,290 results | remaining
Compare Image Part No Manufacturer Description Inventory Pricing Quantity SeriesPackagingPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating TemperatureTermination Post LengthMaterial Flammability RatingCurrent Rating (Amps)Contact Resistance
Compare Image Part No Manufacturer Description Inventory Pricing Quantity SeriesPackagingPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating TemperatureTermination Post LengthMaterial Flammability RatingCurrent Rating (Amps)Contact Resistance
22-3513-11H

Mfr Part No.

22-3513-11H

Internal Code

270-409-1316098
Aries Electronics
CONN IC DIP SOCKET 22POS GOLD
Get a Quote -
Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C 0.125" (3.18mm) UL94 V-0 3 A -
22-3513-11H
22-3513-11H

270-409-1316098 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
223-PLS18017-12

Mfr Part No.

223-PLS18017-12

Internal Code

270-409-1317190
Aries Electronics
CONN SOCKET PGA ZIF GOLD
Get a Quote -
PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C 0.125" (3.18mm) UL94 V-0 1 A -
223-PLS18017-12
223-PLS18017-12

270-409-1317190 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
22-4508-31

Mfr Part No.

22-4508-31

Internal Code

270-409-1319918
Aries Electronics
CONN IC DIP SOCKET 22POS GOLD
Get a Quote -
508 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C 0.500" (12.70mm) UL94 V-0 3 A -
22-4508-31
22-4508-31

270-409-1319918 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
22-4518-10H

Mfr Part No.

22-4518-10H

Internal Code

270-409-1319954
Aries Electronics
CONN IC DIP SOCKET 22POS GOLD
Get a Quote -
518 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled - 0.125" (3.18mm) UL94 V-0 3 A -
22-4518-10H
22-4518-10H

270-409-1319954 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
22-4518-10M

Mfr Part No.

22-4518-10M

Internal Code

270-409-1319955
Aries Electronics
CONN IC DIP SOCKET 22POS GOLD
Get a Quote -
518 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled - 0.125" (3.18mm) UL94 V-0 3 A -
22-4518-10M
22-4518-10M

270-409-1319955 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
39-7XXXX-10

Mfr Part No.

39-7XXXX-10

Internal Code

270-409-1955180
Aries Electronics
CONN SOCKET SIP 39POS TIN
Get a Quote -
700 Elevator Strip-Line™ Bulk Active SIP 39 (1 x 39) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C 0.150" (3.81mm) UL94 V-0 1.5 A -
39-7XXXX-10
39-7XXXX-10

270-409-1955180 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
40-0508-20

Mfr Part No.

40-0508-20

Internal Code

270-409-2006119
Aries Electronics
CONN SOCKET SIP 40POS GOLD
Get a Quote -
508 Bulk Active SIP 40 (1 x 40) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C 0.360" (9.14mm) UL94 V-0 3 A -
40-0508-20
40-0508-20

270-409-2006119 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
40-0518-10H

Mfr Part No.

40-0518-10H

Internal Code

270-409-2006134
Aries Electronics
CONN SOCKET SIP 40POS GOLD
Get a Quote -
518 Bulk Active SIP 40 (1 x 40) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled - 0.125" (3.18mm) UL94 V-0 3 A -
40-0518-10H
40-0518-10H

270-409-2006134 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
400-PLS20001-16

Mfr Part No.

400-PLS20001-16

Internal Code

270-409-2008164
Aries Electronics
CONN SOCKET PGA ZIF GOLD
Get a Quote -
PLS Bulk Obsolete PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Bronze 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 200°C 0.125" (3.18mm) UL94 V-0 1 A -
400-PLS20001-16
400-PLS20001-16

270-409-2008164 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
400-PRS20001-12

Mfr Part No.

400-PRS20001-12

Internal Code

270-409-2008165
Aries Electronics
CONN SOCKET PGA ZIF GOLD
Get a Quote -
PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C 0.125" (3.18mm) UL94 V-0 1 A -
400-PRS20001-12
400-PRS20001-12

270-409-2008165 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
40-1508-21

Mfr Part No.

40-1508-21

Internal Code

270-409-2009305
Aries Electronics
CONN IC DIP SOCKET 40POS GOLD
Get a Quote -
508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C 0.360" (9.14mm) UL94 V-0 3 A -
40-1508-21
40-1508-21

270-409-2009305 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
40-3503-31

Mfr Part No.

40-3503-31

Internal Code

270-409-2012059
Aries Electronics
CONN IC DIP SOCKET 40POS GOLD
Get a Quote -
503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C 0.500" (12.70mm) UL94 V-0 3 A -
40-3503-31
40-3503-31

270-409-2012059 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
40-3551-10

Mfr Part No.

40-3551-10

Internal Code

270-409-2012079
Aries Electronics
CONN IC DIP SOCKET ZIF 40POS TIN
Get a Quote -
55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled - 0.110" (2.78mm) UL94 V-0 1 A -
40-3551-10
40-3551-10

270-409-2012079 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
40-3554-18

Mfr Part No.

40-3554-18

Internal Code

270-409-2012094
Aries Electronics
CONN IC DIP SOCKET ZIF 40POS
Get a Quote -
55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C 0.110" (2.78mm) UL94 V-0 1 A -
40-3554-18
40-3554-18

270-409-2012094 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
40-3571-10

Mfr Part No.

40-3571-10

Internal Code

270-409-2012107
Aries Electronics
CONN IC DIP SOCKET ZIF 40POS TIN
Get a Quote -
57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled - 0.110" (2.78mm) UL94 V-0 1 A -
40-3571-10
40-3571-10

270-409-2012107 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
40-3572-11

Mfr Part No.

40-3572-11

Internal Code

270-409-2012111
Aries Electronics
CONN IC DIP SOCKET ZIF 40POS GLD
Get a Quote -
57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled - 0.110" (2.78mm) UL94 V-0 1 A -
40-3572-11
40-3572-11

270-409-2012111 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
40-3573-16

Mfr Part No.

40-3573-16

Internal Code

270-409-2012115
Aries Electronics
CONN IC DIP SOCKET ZIF 40POS
Get a Quote -
57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled - 0.110" (2.78mm) UL94 V-0 1 A -
40-3573-16
40-3573-16

270-409-2012115 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
40-3574-10

Mfr Part No.

40-3574-10

Internal Code

270-409-2012116
Aries Electronics
CONN IC DIP SOCKET ZIF 40POS GLD
Get a Quote -
57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled - 0.110" (2.78mm) UL94 V-0 1 A -
40-3574-10
40-3574-10

270-409-2012116 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
40-3575-16

Mfr Part No.

40-3575-16

Internal Code

270-409-2012122
Aries Electronics
CONN IC DIP SOCKET ZIF 40POS GLD
Get a Quote -
57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled - 0.110" (2.78mm) UL94 V-0 1 A -
40-3575-16
40-3575-16

270-409-2012122 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
40-6508-201

Mfr Part No.

40-6508-201

Internal Code

270-409-2014761
Aries Electronics
CONN IC DIP SOCKET 40POS GOLD
Get a Quote -
508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C 0.360" (9.14mm) UL94 V-0 3 A -
40-6508-201
40-6508-201

270-409-2014761 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
  • 1
  • ..
  • 42
  • 43
  • 44
  • ..
  • 50

0123456789ABCDEFGHIJKLMNOPQRSTUVWXYZ
Contact Us
+852 4743 2232 [email protected] +852 4743 2232 RM 701, UNIT 108, 7/F, TWR B NEW MANDARIN PLAZA 14 SCIENCE MUSEUM RD TSIM SHA TSUI HONG KONG
Information
About Us Cookie Policy Privacy Policy Terms & Conditions Complaints Policy
Services
Help Centre How to Use Shipping & Delivering Return & Refund FAQs
Quick Links
Community RFQ Shopping Cart Tools Feedback
Follow Us:
Shipping:
UPS DHL Fedex SF-Express
Payment:
VISA Paypal MasterCard pingpong
Privacy Policy Cookie Policy Terms & Conditions
Copyright ©2025 Ansinor Electronics Limited All Rights Reserved.