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Sockets for ICs, Transistors - IC Sockets

4,290 results

Compare	Part No	Manufacturer	Description	Inventory	Pricing	Quantity	Series	Packaging	Part Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature	Termination Post Length	Material Flammability Rating	Current Rating (Amps)	Contact Resistance
	Mfr Part No. 40-6508-211 Internal Code 270-409-2014764	Aries Electronics	CONN IC DIP SOCKET 40POS GOLD	Get a Quote	-		508	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C	0.500" (12.70mm)	UL94 V-0	3 A	-
40-6508-211 270-409-2014764 Aries Electronics RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 40-6508-212 Internal Code 270-409-2014765	Aries Electronics	CONN IC DIP SOCKET 40POS GOLD	Get a Quote	-		508	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C	0.500" (12.70mm)	UL94 V-0	3 A	-
40-6508-212 270-409-2014765 Aries Electronics RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 40-6513-00 Internal Code 270-409-2014778	Aries Electronics	CONN IC DIP SOCKET 40POS GOLD	Get a Quote	-		Lo-PRO®file, 513	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C	0.125" (3.18mm)	UL94 V-0	3 A	-
40-6513-00 270-409-2014778 Aries Electronics RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 40-6518-102 Internal Code 270-409-2014789	Aries Electronics	CONN IC DIP SOCKET 40POS GOLD	Get a Quote	-		518	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-	0.125" (3.18mm)	UL94 V-0	3 A	-
40-6518-102 270-409-2014789 Aries Electronics RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 40-6552-10 Internal Code 270-409-2014828	Aries Electronics	CONN IC DIP SOCKET ZIF 40POS TIN	Get a Quote	-		55	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-	0.110" (2.78mm)	UL94 V-0	1 A	-
40-6552-10 270-409-2014828 Aries Electronics RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 40-6553-10 Internal Code 270-409-2014835	Aries Electronics	CONN IC DIP SOCKET ZIF 40POS GLD	Get a Quote	-		55	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	-	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-	0.110" (2.78mm)	UL94 V-0	1 A	-
40-6553-10 270-409-2014835 Aries Electronics RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 40-6554-10 Internal Code 270-409-2014839	Aries Electronics	CONN IC DIP SOCKET ZIF 40POS TIN	75 Available	1 : $14.672 10 : $13.33819 100 : $12.23687 500 : $11.33043 1000 : $10.58919 3000 : $9.9898	Unit Price: $14.672 Minimum: 1 Multiple: 1	55	Tube	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-	0.110" (2.78mm)	UL94 V-0	1 A	-
40-6554-10 270-409-2014839 Aries Electronics RoHS : Package: - Inventory: 75 1 : $14.672
	Mfr Part No. 40-6554-11 Internal Code 270-409-2014840	Aries Electronics	CONN IC DIP SOCKET ZIF 40POS GLD	36 Available	1 : $23.024 10 : $20.93091 100 : $19.20267 500 : $17.78025 1000 : $16.61706 3000 : $15.67646	Unit Price: $23.024 Minimum: 1 Multiple: 1	55	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	-	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-	0.110" (2.78mm)	UL94 V-0	1 A	-
40-6554-11 270-409-2014840 Aries Electronics RoHS : Package: - Inventory: 36 1 : $23.024
	Mfr Part No. 40-6571-10 Internal Code 270-409-2014863	Aries Electronics	CONN IC DIP SOCKET ZIF 40POS TIN	Get a Quote	-		57	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-	0.110" (2.78mm)	UL94 V-0	1 A	-
40-6571-10 270-409-2014863 Aries Electronics RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 40-6571-11 Internal Code 270-409-2014864	Aries Electronics	CONN IC DIP SOCKET ZIF 40POS GLD	Get a Quote	-		57	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-	0.110" (2.78mm)	UL94 V-0	1 A	-
40-6571-11 270-409-2014864 Aries Electronics RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 40-6573-10 Internal Code 270-409-2014869	Aries Electronics	CONN IC DIP SOCKET ZIF 40POS TIN	Get a Quote	-		57	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-	0.110" (2.78mm)	UL94 V-0	1 A	-
40-6573-10 270-409-2014869 Aries Electronics RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 40-6574-11 Internal Code 270-409-2014873	Aries Electronics	CONN IC DIP SOCKET ZIF 40POS TIN	Get a Quote	-		57	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-	0.110" (2.78mm)	UL94 V-0	1 A	-
40-6574-11 270-409-2014873 Aries Electronics RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 40-6574-16 Internal Code 270-409-2014874	Aries Electronics	CONN IC DIP SOCKET ZIF 40POS TIN	Get a Quote	-		57	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-	0.110" (2.78mm)	UL94 V-0	1 A	-
40-6574-16 270-409-2014874 Aries Electronics RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 40-6575-18 Internal Code 270-409-2014879	Aries Electronics	CONN IC DIP SOCKET ZIF 40POS TIN	Get a Quote	-		57	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-	0.110" (2.78mm)	UL94 V-0	1 A	-
40-6575-18 270-409-2014879 Aries Electronics RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 40-6820-90C Internal Code 270-409-2015013	Aries Electronics	CONN IC DIP SOCKET 40POS GOLD	Get a Quote	-		Vertisockets™ 800	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C	0.140" (3.56mm)	UL94 V-0	3 A	-
40-6820-90C 270-409-2015013 Aries Electronics RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 40-6822-90C Internal Code 270-409-2015015	Aries Electronics	CONN IC DIP SOCKET 40POS GOLD	Get a Quote	-		Vertisockets™ 800	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C	0.140" (3.56mm)	UL94 V-0	3 A	-
40-6822-90C 270-409-2015015 Aries Electronics RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 40-6822-90T Internal Code 270-409-2015016	Aries Electronics	CONN IC DIP SOCKET 40POS TIN	Get a Quote	-		Vertisockets™ 800	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6	-	0.145" (3.68mm)	UL94 V-0	1.5 A	-
40-6822-90T 270-409-2015016 Aries Electronics RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 40-6823-90 Internal Code 270-409-2015017	Aries Electronics	CONN IC DIP SOCKET 40POS GOLD	160 Available	1 : $18.592 10 : $16.90181 100 : $15.50626 500 : $14.35764 1000 : $13.41836 3000 : $12.65883	Unit Price: $18.592 Minimum: 1 Multiple: 1	Vertisockets™ 800	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6	-	0.145" (3.68mm)	UL94 V-0	1.5 A	-
40-6823-90 270-409-2015017 Aries Electronics RoHS : Package: - Inventory: 160 1 : $18.592
	Mfr Part No. 40-823-90C Internal Code 270-409-2017056	Aries Electronics	CONN IC DIP SOCKET 40POS GOLD	Get a Quote	-		Vertisockets™ 800	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C	0.140" (3.56mm)	UL94 V-0	3 A	-
40-823-90C 270-409-2017056 Aries Electronics RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 40-8260-610C Internal Code 270-409-2017065	Aries Electronics	CONN IC DIP SOCKET 40POS GOLD	Get a Quote	-		8	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C	0.140" (3.56mm)	UL94 V-0	3 A	-
40-8260-610C 270-409-2017065 Aries Electronics RoHS : Package: - Inventory: - 1 : -

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