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Compare | Image | Part No | Manufacturer | Description | Inventory | Pricing | Quantity | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature | Termination Post Length | Material Flammability Rating | Current Rating (Amps) | Contact Resistance |
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Mfr Part No.40-8300-310CInternal Code270-409-2017114 | Aries Electronics |
CONN IC DIP SOCKET 40POS GOLD
| Get a Quote | - | 8 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C | 0.140" (3.56mm) | UL94 V-0 | 3 A | - | |||
40-8300-310C | |||||||||||||||||||||||||||||
Mfr Part No.40-8600-610CInternal Code270-409-2017268 | Aries Electronics |
CONN IC DIP SOCKET 40POS GOLD
| Get a Quote | - | 8 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C | 0.140" (3.56mm) | UL94 V-0 | 3 A | - | |||
40-8600-610C | |||||||||||||||||||||||||||||
Mfr Part No.40-8700-310CInternal Code270-409-2017328 | Aries Electronics |
CONN IC DIP SOCKET 40POS GOLD
| Get a Quote | - | 8 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C | 0.140" (3.56mm) | UL94 V-0 | 3 A | - | |||
40-8700-310C | |||||||||||||||||||||||||||||
Mfr Part No.40-8785-310CInternal Code270-409-2017360 | Aries Electronics |
CONN IC DIP SOCKET 40POS GOLD
| Get a Quote | - | 8 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C | 0.140" (3.56mm) | UL94 V-0 | 3 A | - | |||
40-8785-310C | |||||||||||||||||||||||||||||
Mfr Part No.40-8800-610CInternal Code270-409-2017364 | Aries Electronics |
CONN IC DIP SOCKET 40POS GOLD
| Get a Quote | - | 8 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C | 0.140" (3.56mm) | UL94 V-0 | 3 A | - | |||
40-8800-610C | |||||||||||||||||||||||||||||
Mfr Part No.40-9513-10TInternal Code270-409-2017728 | Aries Electronics |
CONN IC DIP SOCKET 40POS GOLD
| Get a Quote | - | Lo-PRO®file, 513 | Bulk | Active | DIP, 0.9" (22.86mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C | 0.125" (3.18mm) | UL94 V-0 | 3 A | - | |||
40-9513-10T | |||||||||||||||||||||||||||||
Mfr Part No.40-C182-30Internal Code270-409-2018275 | Aries Electronics |
CONN IC DIP SOCKET 40POS GOLD
| Get a Quote | - | EJECT-A-DIP™ | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Surface Mount | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C | 0.040" (1.02mm) | UL94 V-0 | 3 A | - | |||
40-C182-30 | |||||||||||||||||||||||||||||
Mfr Part No.40-C300-00Internal Code270-409-2018957 | Aries Electronics |
CONN IC DIP SOCKET 40POS GOLD
| Get a Quote | - | EJECT-A-DIP™ | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Surface Mount | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C | 0.040" (1.02mm) | UL94 V-0 | 3 A | - | |||
40-C300-00 | |||||||||||||||||||||||||||||
Mfr Part No.42-3553-16Internal Code270-409-2054754 | Aries Electronics |
CONN IC DIP SOCKET ZIF 42POS
| Get a Quote | - | 55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 42 (2 x 21) | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - | 0.110" (2.78mm) | UL94 V-0 | 1 A | - | |||
42-3553-16 | |||||||||||||||||||||||||||||
Mfr Part No.42-3554-16Internal Code270-409-2054759 | Aries Electronics |
CONN IC DIP SOCKET ZIF 42POS
| Get a Quote | - | 55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 42 (2 x 21) | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - | 0.110" (2.78mm) | UL94 V-0 | 1 A | - | |||
42-3554-16 | |||||||||||||||||||||||||||||
Mfr Part No.42-3570-16Internal Code270-409-2054770 | Aries Electronics |
CONN IC DIP SOCKET ZIF 42POS
| Get a Quote | - | 57 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 42 (2 x 21) | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Polyphenylene Sulfide (PPS), Glass Filled | - | 0.110" (2.78mm) | UL94 V-0 | 1 A | - | |||
42-3570-16 | |||||||||||||||||||||||||||||
Mfr Part No.42-3571-16Internal Code270-409-2054773 | Aries Electronics |
CONN IC DIP SOCKET ZIF 42POS
| Get a Quote | - | 57 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 42 (2 x 21) | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Polyphenylene Sulfide (PPS), Glass Filled | - | 0.110" (2.78mm) | UL94 V-0 | 1 A | - | |||
42-3571-16 | |||||||||||||||||||||||||||||
Mfr Part No.42-3572-10Internal Code270-409-2054774 | Aries Electronics |
CONN IC DIP SOCKET ZIF 42POS TIN
| Get a Quote | - | 57 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 42 (2 x 21) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - | 0.110" (2.78mm) | UL94 V-0 | 1 A | - | |||
42-3572-10 | |||||||||||||||||||||||||||||
Mfr Part No.42-3575-18Internal Code270-409-2054787 | Aries Electronics |
CONN IC DIP SOCKET ZIF 42POS TIN
| Get a Quote | - | 57 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 42 (2 x 21) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - | 0.110" (2.78mm) | UL94 V-0 | 1 A | - | |||
42-3575-18 | |||||||||||||||||||||||||||||
Mfr Part No.4236-118-14Internal Code270-409-2054794 | Aries Electronics |
518 OPN FRM COLLET SCKT SLDR TAI
| Get a Quote | - | - | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |||
4236-118-14 | |||||||||||||||||||||||||||||
Mfr Part No.42-6552-10Internal Code270-409-2056608 | Aries Electronics |
CONN IC DIP SOCKET ZIF 42POS TIN
| Get a Quote | - | 55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 42 (2 x 21) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - | 0.110" (2.78mm) | UL94 V-0 | 1 A | - | |||
42-6552-10 | |||||||||||||||||||||||||||||
Mfr Part No.42-6552-11Internal Code270-409-2056609 | Aries Electronics |
CONN IC DIP SOCKET ZIF 42POS GLD
| Get a Quote | - | 55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 42 (2 x 21) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - | 0.110" (2.78mm) | UL94 V-0 | 1 A | - | |||
42-6552-11 | |||||||||||||||||||||||||||||
Mfr Part No.42-6552-16Internal Code270-409-2056610 | Aries Electronics |
CONN IC DIP SOCKET ZIF 42POS
| Get a Quote | - | 55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 42 (2 x 21) | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - | 0.110" (2.78mm) | UL94 V-0 | 1 A | - | |||
42-6552-16 | |||||||||||||||||||||||||||||
Mfr Part No.42-6553-16Internal Code270-409-2056613 | Aries Electronics |
CONN IC DIP SOCKET ZIF 42POS
| Get a Quote | - | 55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 42 (2 x 21) | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - | 0.110" (2.78mm) | UL94 V-0 | 1 A | - | |||
42-6553-16 | |||||||||||||||||||||||||||||
Mfr Part No.42-6554-18Internal Code270-409-2056618 | Aries Electronics |
CONN IC DIP SOCKET ZIF 42POS
| Get a Quote | - | 55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 42 (2 x 21) | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Polyetheretherketone (PEEK), Glass Filled | -55°C ~ 250°C | 0.110" (2.78mm) | UL94 V-0 | 1 A | - | |||
42-6554-18 |