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4,290 results | remaining
Compare Image Part No Manufacturer Description Inventory Pricing Quantity SeriesPackagingPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating TemperatureTermination Post LengthMaterial Flammability RatingCurrent Rating (Amps)Contact Resistance
Compare Image Part No Manufacturer Description Inventory Pricing Quantity SeriesPackagingPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating TemperatureTermination Post LengthMaterial Flammability RatingCurrent Rating (Amps)Contact Resistance
40-8300-310C

Mfr Part No.

40-8300-310C

Internal Code

270-409-2017114
Aries Electronics
CONN IC DIP SOCKET 40POS GOLD
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8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C 0.140" (3.56mm) UL94 V-0 3 A -
40-8300-310C
40-8300-310C

270-409-2017114 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
40-8600-610C

Mfr Part No.

40-8600-610C

Internal Code

270-409-2017268
Aries Electronics
CONN IC DIP SOCKET 40POS GOLD
Get a Quote -
8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C 0.140" (3.56mm) UL94 V-0 3 A -
40-8600-610C
40-8600-610C

270-409-2017268 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
40-8700-310C

Mfr Part No.

40-8700-310C

Internal Code

270-409-2017328
Aries Electronics
CONN IC DIP SOCKET 40POS GOLD
Get a Quote -
8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C 0.140" (3.56mm) UL94 V-0 3 A -
40-8700-310C
40-8700-310C

270-409-2017328 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
40-8785-310C

Mfr Part No.

40-8785-310C

Internal Code

270-409-2017360
Aries Electronics
CONN IC DIP SOCKET 40POS GOLD
Get a Quote -
8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C 0.140" (3.56mm) UL94 V-0 3 A -
40-8785-310C
40-8785-310C

270-409-2017360 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
40-8800-610C

Mfr Part No.

40-8800-610C

Internal Code

270-409-2017364
Aries Electronics
CONN IC DIP SOCKET 40POS GOLD
Get a Quote -
8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C 0.140" (3.56mm) UL94 V-0 3 A -
40-8800-610C
40-8800-610C

270-409-2017364 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
40-9513-10T

Mfr Part No.

40-9513-10T

Internal Code

270-409-2017728
Aries Electronics
CONN IC DIP SOCKET 40POS GOLD
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Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C 0.125" (3.18mm) UL94 V-0 3 A -
40-9513-10T
40-9513-10T

270-409-2017728 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
40-C182-30

Mfr Part No.

40-C182-30

Internal Code

270-409-2018275
Aries Electronics
CONN IC DIP SOCKET 40POS GOLD
Get a Quote -
EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C 0.040" (1.02mm) UL94 V-0 3 A -
40-C182-30
40-C182-30

270-409-2018275 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
40-C300-00

Mfr Part No.

40-C300-00

Internal Code

270-409-2018957
Aries Electronics
CONN IC DIP SOCKET 40POS GOLD
Get a Quote -
EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C 0.040" (1.02mm) UL94 V-0 3 A -
40-C300-00
40-C300-00

270-409-2018957 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
42-3553-16

Mfr Part No.

42-3553-16

Internal Code

270-409-2054754
Aries Electronics
CONN IC DIP SOCKET ZIF 42POS
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55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled - 0.110" (2.78mm) UL94 V-0 1 A -
42-3553-16
42-3553-16

270-409-2054754 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
42-3554-16

Mfr Part No.

42-3554-16

Internal Code

270-409-2054759
Aries Electronics
CONN IC DIP SOCKET ZIF 42POS
Get a Quote -
55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled - 0.110" (2.78mm) UL94 V-0 1 A -
42-3554-16
42-3554-16

270-409-2054759 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
42-3570-16

Mfr Part No.

42-3570-16

Internal Code

270-409-2054770
Aries Electronics
CONN IC DIP SOCKET ZIF 42POS
Get a Quote -
57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled - 0.110" (2.78mm) UL94 V-0 1 A -
42-3570-16
42-3570-16

270-409-2054770 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
42-3571-16

Mfr Part No.

42-3571-16

Internal Code

270-409-2054773
Aries Electronics
CONN IC DIP SOCKET ZIF 42POS
Get a Quote -
57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled - 0.110" (2.78mm) UL94 V-0 1 A -
42-3571-16
42-3571-16

270-409-2054773 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
42-3572-10

Mfr Part No.

42-3572-10

Internal Code

270-409-2054774
Aries Electronics
CONN IC DIP SOCKET ZIF 42POS TIN
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57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled - 0.110" (2.78mm) UL94 V-0 1 A -
42-3572-10
42-3572-10

270-409-2054774 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
42-3575-18

Mfr Part No.

42-3575-18

Internal Code

270-409-2054787
Aries Electronics
CONN IC DIP SOCKET ZIF 42POS TIN
Get a Quote -
57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled - 0.110" (2.78mm) UL94 V-0 1 A -
42-3575-18
42-3575-18

270-409-2054787 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
4236-118-14

Mfr Part No.

4236-118-14

Internal Code

270-409-2054794
Aries Electronics
518 OPN FRM COLLET SCKT SLDR TAI
Get a Quote -
- - Active - - - - - - - - - - - - - - - - - - -
4236-118-14
4236-118-14

270-409-2054794 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
42-6552-10

Mfr Part No.

42-6552-10

Internal Code

270-409-2056608
Aries Electronics
CONN IC DIP SOCKET ZIF 42POS TIN
Get a Quote -
55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled - 0.110" (2.78mm) UL94 V-0 1 A -
42-6552-10
42-6552-10

270-409-2056608 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
42-6552-11

Mfr Part No.

42-6552-11

Internal Code

270-409-2056609
Aries Electronics
CONN IC DIP SOCKET ZIF 42POS GLD
Get a Quote -
55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled - 0.110" (2.78mm) UL94 V-0 1 A -
42-6552-11
42-6552-11

270-409-2056609 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
42-6552-16

Mfr Part No.

42-6552-16

Internal Code

270-409-2056610
Aries Electronics
CONN IC DIP SOCKET ZIF 42POS
Get a Quote -
55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled - 0.110" (2.78mm) UL94 V-0 1 A -
42-6552-16
42-6552-16

270-409-2056610 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
42-6553-16

Mfr Part No.

42-6553-16

Internal Code

270-409-2056613
Aries Electronics
CONN IC DIP SOCKET ZIF 42POS
Get a Quote -
55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled - 0.110" (2.78mm) UL94 V-0 1 A -
42-6553-16
42-6553-16

270-409-2056613 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
42-6554-18

Mfr Part No.

42-6554-18

Internal Code

270-409-2056618
Aries Electronics
CONN IC DIP SOCKET ZIF 42POS
Get a Quote -
55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C 0.110" (2.78mm) UL94 V-0 1 A -
42-6554-18
42-6554-18

270-409-2056618 Aries Electronics
RoHS :
Package: -
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