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Sockets for ICs, Transistors - IC Sockets

4,290 results

Compare	Part No	Manufacturer	Description	Inventory	Pricing	Series	Packaging	Part Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature	Termination Post Length	Material Flammability Rating	Current Rating (Amps)	Contact Resistance
	Mfr Part No. 300-PRS20006-12 Internal Code 270-409-1480829	Aries Electronics	CONN SOCKET PGA ZIF GOLD	Get a Quote	-	PRS	Bulk	Active	PGA, ZIF (ZIP)	-	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)	-65°C ~ 125°C	0.125" (3.18mm)	UL94 V-0	1 A	-
300-PRS20006-12 270-409-1480829 Aries Electronics RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 30-1508-21 Internal Code 270-409-1482212	Aries Electronics	CONN IC DIP SOCKET 30POS GOLD	Get a Quote	-	508	Bulk	Active	DIP, 0.2" (5.08mm) Row Spacing	30 (2 x 15)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6	-55°C ~ 125°C	0.360" (9.14mm)	UL94 V-0	3 A	-
30-1508-21 270-409-1482212 Aries Electronics RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 30-1508-30 Internal Code 270-409-1482213	Aries Electronics	CONN IC DIP SOCKET 30POS GOLD	Get a Quote	-	508	Bulk	Active	DIP, 0.2" (5.08mm) Row Spacing	30 (2 x 15)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6	-55°C ~ 105°C	0.500" (12.70mm)	UL94 V-0	3 A	-
30-1508-30 270-409-1482213 Aries Electronics RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 30-1518-10 Internal Code 270-409-1482223	Aries Electronics	CONN IC DIP SOCKET 30POS GOLD	Get a Quote	-	518	Bulk	Active	DIP, 0.2" (5.08mm) Row Spacing	30 (2 x 15)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-	0.125" (3.18mm)	UL94 V-0	3 A	-
30-1518-10 270-409-1482223 Aries Electronics RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 30-3503-20 Internal Code 270-409-1487873	Aries Electronics	CONN IC DIP SOCKET 30POS GOLD	Get a Quote	-	503	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	30 (2 x 15)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C	0.360" (9.14mm)	UL94 V-0	3 A	-
30-3503-20 270-409-1487873 Aries Electronics RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 30-3503-30 Internal Code 270-409-1487875	Aries Electronics	CONN IC DIP SOCKET 30POS GOLD	Get a Quote	-	503	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	30 (2 x 15)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C	0.500" (12.70mm)	UL94 V-0	3 A	-
30-3503-30 270-409-1487875 Aries Electronics RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 30-3503-31 Internal Code 270-409-1487876	Aries Electronics	CONN IC DIP SOCKET 30POS GOLD	Get a Quote	-	503	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	30 (2 x 15)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C	0.500" (12.70mm)	UL94 V-0	3 A	-
30-3503-31 270-409-1487876 Aries Electronics RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 30-6501-21 Internal Code 270-409-1503548	Aries Electronics	CONN IC DIP SOCKET 30POS GOLD	Get a Quote	-	501	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	30 (2 x 15)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C	0.410" (10.41mm)	UL94 V-0	1.5 A	-
30-6501-21 270-409-1503548 Aries Electronics RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 30-6503-21 Internal Code 270-409-1503552	Aries Electronics	CONN IC DIP SOCKET 30POS GOLD	Get a Quote	-	503	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	30 (2 x 15)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C	0.360" (9.14mm)	UL94 V-0	3 A	-
30-6503-21 270-409-1503552 Aries Electronics RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 30-6513-10 Internal Code 270-409-1503558	Aries Electronics	CONN IC DIP SOCKET 30POS GOLD	Get a Quote	-	Lo-PRO®file, 513	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	30 (2 x 15)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C	0.125" (3.18mm)	UL94 V-0	3 A	-
30-6513-10 270-409-1503558 Aries Electronics RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 30-6513-10T Internal Code 270-409-1503560	Aries Electronics	CONN IC DIP SOCKET 30POS GOLD	Get a Quote	-	Lo-PRO®file, 513	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	30 (2 x 15)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C	0.125" (3.18mm)	UL94 V-0	3 A	-
30-6513-10T 270-409-1503560 Aries Electronics RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 30-7440-10 Internal Code 270-409-1524866	Aries Electronics	CONN SOCKET SIP 30POS TIN	Get a Quote	-	700 Elevator Strip-Line™	Bulk	Active	SIP	30 (1 x 30)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C	0.150" (3.81mm)	UL94 V-0	1.5 A	-
30-7440-10 270-409-1524866 Aries Electronics RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 30-8563-610C Internal Code 270-409-1527709	Aries Electronics	CONN IC DIP SOCKET 30POS GOLD	Get a Quote	-	8	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	30 (2 x 15)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C	0.140" (3.56mm)	UL94 V-0	3 A	-
30-8563-610C 270-409-1527709 Aries Electronics RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 30-9503-21 Internal Code 270-409-1530310	Aries Electronics	CONN IC DIP SOCKET 30POS GOLD	Get a Quote	-	503	Bulk	Active	DIP, 0.9" (22.86mm) Row Spacing	30 (2 x 15)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C	0.360" (9.14mm)	UL94 V-0	3 A	-
30-9503-21 270-409-1530310 Aries Electronics RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 30-9503-30 Internal Code 270-409-1530311	Aries Electronics	CONN IC DIP SOCKET 30POS GOLD	Get a Quote	-	503	Bulk	Active	DIP, 0.9" (22.86mm) Row Spacing	30 (2 x 15)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C	0.500" (12.70mm)	UL94 V-0	3 A	-
30-9503-30 270-409-1530311 Aries Electronics RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 30-PRS16017-12 Internal Code 270-409-1534057	Aries Electronics	CONN SOCKET PGA ZIF GOLD	Get a Quote	-	PRS	Bulk	Active	PGA, ZIF (ZIP)	-	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)	-65°C ~ 125°C	0.125" (3.18mm)	UL94 V-0	1 A	-
30-PRS16017-12 270-409-1534057 Aries Electronics RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 31-0501-21 Internal Code 270-409-1537426	Aries Electronics	CONN SOCKET SIP 31POS GOLD	Get a Quote	-	501	Bulk	Active	SIP	31 (1 x 31)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole	-	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C	0.420" (10.67mm)	UL94 V-0	1 A	-
31-0501-21 270-409-1537426 Aries Electronics RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 31-0511-10 Internal Code 270-409-1537446	Aries Electronics	CONN SOCKET SIP 31POS TIN	Get a Quote	-	511	Bulk	Active	SIP	31 (1 x 31)	0.100" (2.54mm)	Tin	50.0µin (1.27µm)	Phosphor Bronze	Through Hole	-	Solder	0.100" (2.54mm)	Tin	50.0µin (1.27µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C	0.150" (3.81mm)	UL94 V-0	1 A	-
31-0511-10 270-409-1537446 Aries Electronics RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 31-0518-11 Internal Code 270-409-1537455	Aries Electronics	CONN SOCKET SIP 31POS GOLD	Get a Quote	-	518	Bulk	Active	SIP	31 (1 x 31)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-	0.125" (3.18mm)	UL94 V-0	3 A	-
31-0518-11 270-409-1537455 Aries Electronics RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 24-0508-30 Internal Code 270-409-1363322	Aries Electronics	CONN SOCKET SIP 24POS GOLD	Get a Quote	-	508	Bulk	Active	SIP	24 (1 x 24)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Wire Wrap	-	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6	-55°C ~ 105°C	0.500" (12.70mm)	UL94 V-0	3 A	-
24-0508-30 270-409-1363322 Aries Electronics RoHS : Package: - Inventory: - 1 : -

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