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| Compare | Image | Part No | Manufacturer | Description | Inventory | Pricing | Quantity | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature | Termination Post Length | Material Flammability Rating | Current Rating (Amps) | Contact Resistance |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No.24-3551-11Internal Code270-409-1369132 | Aries Electronics |
CONN IC DIP SOCKET ZIF 24POS GLD
| Get a Quote | - | 55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - | 0.110" (2.78mm) | UL94 V-0 | 1 A | - | ||
| 24-3551-11 | |||||||||||||||||||||||||||||
| | Mfr Part No.24-3552-10Internal Code270-409-1369135 | Aries Electronics |
CONN IC DIP SOCKET ZIF 24POS TIN
| Get a Quote | - | 55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - | 0.110" (2.78mm) | UL94 V-0 | 1 A | - | ||
| 24-3552-10 | |||||||||||||||||||||||||||||
| | Mfr Part No.24-3552-16Internal Code270-409-1369137 | Aries Electronics |
CONN IC DIP SOCKET ZIF 24POS
| Get a Quote | - | 55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - | 0.110" (2.78mm) | UL94 V-0 | 1 A | - | ||
| 24-3552-16 | |||||||||||||||||||||||||||||
| | Mfr Part No.24-3553-10Internal Code270-409-1369139 | Aries Electronics |
CONN IC DIP SOCKET ZIF 24POS TIN
| Get a Quote | - | 55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - | 0.110" (2.78mm) | UL94 V-0 | 1 A | - | ||
| 24-3553-10 | |||||||||||||||||||||||||||||
| | Mfr Part No.24-3553-16Internal Code270-409-1369141 | Aries Electronics |
CONN IC DIP SOCKET ZIF 24POS
| Get a Quote | - | 55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - | 0.110" (2.78mm) | UL94 V-0 | 1 A | - | ||
| 24-3553-16 | |||||||||||||||||||||||||||||
| | Mfr Part No.24-3553-18Internal Code270-409-1369142 | Aries Electronics |
CONN IC DIP SOCKET ZIF 24POS
| Get a Quote | - | 55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Polyetheretherketone (PEEK), Glass Filled | -55°C ~ 250°C | 0.110" (2.78mm) | UL94 V-0 | 1 A | - | ||
| 24-3553-18 | |||||||||||||||||||||||||||||
| | Mfr Part No.24-3554-10Internal Code270-409-1369143 | Aries Electronics |
CONN IC DIP SOCKET ZIF 24POS TIN
| Get a Quote | - | 55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - | 0.110" (2.78mm) | UL94 V-0 | 1 A | - | ||
| 24-3554-10 | |||||||||||||||||||||||||||||
| | Mfr Part No.24-3554-16Internal Code270-409-1369145 | Aries Electronics |
CONN IC DIP SOCKET ZIF 24POS
| Get a Quote | - | 55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - | 0.110" (2.78mm) | UL94 V-0 | 1 A | - | ||
| 24-3554-16 | |||||||||||||||||||||||||||||
| | Mfr Part No.24-3570-10Internal Code270-409-1369161 | Aries Electronics |
CONN IC DIP SOCKET ZIF 24POS TIN
| Get a Quote | - | 57 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - | 0.110" (2.78mm) | UL94 V-0 | 1 A | - | ||
| 24-3570-10 | |||||||||||||||||||||||||||||
| | Mfr Part No.24-3570-16Internal Code270-409-1369163 | Aries Electronics |
CONN IC DIP SOCKET ZIF 24POS
| Get a Quote | - | 57 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Polyphenylene Sulfide (PPS), Glass Filled | - | 0.110" (2.78mm) | UL94 V-0 | 1 A | - | ||
| 24-3570-16 | |||||||||||||||||||||||||||||
| | Mfr Part No.24-3573-16Internal Code270-409-1369173 | Aries Electronics |
CONN IC DIP SOCKET ZIF 24POS
| Get a Quote | - | 57 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Polyphenylene Sulfide (PPS), Glass Filled | - | 0.110" (2.78mm) | UL94 V-0 | 1 A | - | ||
| 24-3573-16 | |||||||||||||||||||||||||||||
| | Mfr Part No.24-3575-11Internal Code270-409-1369179 | Aries Electronics |
CONN IC DIP SOCKET ZIF 24POS TIN
| Get a Quote | - | 57 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - | 0.110" (2.78mm) | UL94 V-0 | 1 A | - | ||
| 24-3575-11 | |||||||||||||||||||||||||||||
| | Mfr Part No.24-3575-18Internal Code270-409-1369181 | Aries Electronics |
CONN IC DIP SOCKET ZIF 24POS TIN
| Get a Quote | - | 57 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - | 0.110" (2.78mm) | UL94 V-0 | 1 A | - | ||
| 24-3575-18 | |||||||||||||||||||||||||||||
| | Mfr Part No.24-4518-00Internal Code270-409-1370067 | Aries Electronics |
CONN IC DIP SOCKET 24POS GOLD
| Get a Quote | - | 518 | Bulk | Active | DIP, 0.4" (10.16mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - | 0.125" (3.18mm) | UL94 V-0 | 3 A | - | ||
| 24-4518-00 | |||||||||||||||||||||||||||||
| | Mfr Part No.24-4518-10MInternal Code270-409-1370073 | Aries Electronics |
CONN IC DIP SOCKET 24POS GOLD
| Get a Quote | - | 518 | Bulk | Active | DIP, 0.4" (10.16mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - | 0.125" (3.18mm) | UL94 V-0 | 3 A | - | ||
| 24-4518-10M | |||||||||||||||||||||||||||||
| | Mfr Part No.24-516-11SInternal Code270-409-1371293 | Aries Electronics |
CONN IC DIP SOCKET ZIF 24POS GLD
| Get a Quote | - | 516 | Bulk | Active | DIP, ZIF (ZIP) | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polyamide (PA46), Nylon 4/6, Glass Filled | - | 0.150" (3.81mm) | UL94 V-0 | 1 A | - | ||
| 24-516-11S | |||||||||||||||||||||||||||||
| | Mfr Part No.24-526-11Internal Code270-409-1371328 | Aries Electronics |
CONN IC DIP SOCKET ZIF 24POS GLD
| Get a Quote | - | Lo-PRO®file, 526 | Bulk | Active | DIP, ZIF (ZIP) | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C | 0.105" (2.67mm) | UL94 V-0 | 3 A | - | ||
| 24-526-11 | |||||||||||||||||||||||||||||
| | Mfr Part No.24-6501-31Internal Code270-409-1373332 | Aries Electronics |
CONN IC DIP SOCKET 24POS GOLD
| Get a Quote | - | 501 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C | 0.690" (17.52mm) | UL94 V-0 | 1.5 A | - | ||
| 24-6501-31 | |||||||||||||||||||||||||||||
| | Mfr Part No.24-6503-21Internal Code270-409-1373335 | Aries Electronics |
CONN IC DIP SOCKET 24POS GOLD
| Get a Quote | - | 503 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C | 0.360" (9.14mm) | UL94 V-0 | 3 A | - | ||
| 24-6503-21 | |||||||||||||||||||||||||||||
| | Mfr Part No.24-6508-211Internal Code270-409-1373347 | Aries Electronics |
CONN IC DIP SOCKET 24POS GOLD
| Get a Quote | - | 508 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C | 0.500" (12.70mm) | UL94 V-0 | 3 A | - | ||
| 24-6508-211 |