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1,422
results
| Compare | Image | Part No | Manufacturer | Description | Inventory | Pricing | Quantity | Series | Packaging | Part Status | Applications | Current - Supply | Voltage - Supply | Operating Temperature | Grade | Qualification | Mounting Type | Package / Case | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No.MC33FS8510B6KSInternal Code1778-761-8893496 | NXP USA Inc. |
FS8500 C0
| Get a Quote | - | - | Tray | Active | System Basis Chip | 15mA | 60V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) | ||
| MC33FS8510B6KS | |||||||||||||||||||
| | Mfr Part No.MC33FS8510C4ESR2Internal Code1778-761-8893500 | NXP USA Inc. |
PMIC, SAFETY, 2 BUCKS
| Get a Quote | - | - | Tape & Reel (TR) | Active | System Basis Chip | 15mA | 60V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) | ||
| MC33FS8510C4ESR2 | |||||||||||||||||||
| | Mfr Part No.MC33FS8510C4KSInternal Code1778-761-8893501 | NXP USA Inc. |
FS8500 C0
| Get a Quote | - | - | Tray | Active | System Basis Chip | 15mA | 60V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) | ||
| MC33FS8510C4KS | |||||||||||||||||||
 | Mfr Part No.MC33FS8510D3ESInternal Code1778-761-8893503 | NXP USA Inc. |
FS8510
| Get a Quote | - | - | Tray | Active | Power Supplies | - | 60V | -40°C ~ 125°C (TA) | Automotive | - | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) | ||
| MC33FS8510D3ES | |||||||||||||||||||
 | Mfr Part No.MC33FS8520A0ESInternal Code1778-761-8893507 | NXP USA Inc. |
SAFETY POWER MANAGEMENT IC, QFN5
| Get a Quote | - | - | Tray | Active | System Basis Chip | 15mA | 60V | -40°C ~ 125°C (TA) | - | - | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) | ||
| MC33FS8520A0ES | |||||||||||||||||||
| | Mfr Part No.MC33FS8530A0ESR2Internal Code1778-761-8893512 | NXP USA Inc. |
SYSTEM BASIS CHIP FS8500
| Get a Quote | - | * | Tape & Reel (TR) | Active | - | - | - | - | - | - | - | - | - | ||
| MC33FS8530A0ESR2 | |||||||||||||||||||
| | Mfr Part No.MC33FS8530A1ESR2Internal Code1778-761-8893516 | NXP USA Inc. |
SYSTEM BASIS CHIP FS8500
| Get a Quote | - | * | Tape & Reel (TR) | Active | - | - | - | - | - | - | - | - | - | ||
| MC33FS8530A1ESR2 | |||||||||||||||||||
| | Mfr Part No.MC33FS8530A4ESInternal Code1778-761-8893519 | NXP USA Inc. |
SYSTEM BASIS CHIP FS8530
| Get a Quote | - | * | Tray | Active | - | - | - | - | - | - | - | - | - | ||
| MC33FS8530A4ES | |||||||||||||||||||
 | Mfr Part No.MC33PF3000A0ESInternal Code1778-761-8893559 | NXP USA Inc. |
POWER MANAGEMENT IC I.MX7 PRE-
| 274 Available |
|
Unit Price:
$6.1912 Minimum: 1 Multiple: 1 | - | Tray | Active | i.MX Processors | - | 2.8V ~ 5.5V | -40°C ~ 105°C | - | - | Surface Mount, Wettable Flank | 48-VFQFN Exposed Pad | 48-QFN (7x7) | |
| MC33PF3000A0ES | |||||||||||||||||||
| | Mfr Part No.MC33PF3000A6ESR2Internal Code1778-761-8893565 | NXP USA Inc. |
POWER MANAGEMENT IC I.MX7 PRE-
| Get a Quote | - | - | Tape & Reel (TR) | Active | i.MX Processors | - | 2.8V ~ 5.5V | -40°C ~ 105°C | - | - | Surface Mount, Wettable Flank | 48-VFQFN Exposed Pad | 48-QFN (7x7) | ||
| MC33PF3000A6ESR2 | |||||||||||||||||||
| | Mfr Part No.MC33PF8100A0ESInternal Code1778-761-8893567 | NXP USA Inc. |
IC POWER MANAGEMENT
| 253 Available |
|
Unit Price:
$7.2775 Minimum: 1 Multiple: 1 | - | Tray | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) | |
| MC33PF8100A0ES | |||||||||||||||||||
| | Mfr Part No.MC33PF8100CDESInternal Code1778-761-8893571 | NXP USA Inc. |
IC POWER MANAGEMENT I.MX8QM
| Get a Quote | - | - | Tray | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) | ||
| MC33PF8100CDES | |||||||||||||||||||
| | Mfr Part No.MC33PF8100FJESR2Internal Code1778-761-8893589 | NXP USA Inc. |
POWER MANAGEMENT IC, I.MX8, PRE-
| Get a Quote | - | - | Tape & Reel (TR) | Active | Processor | 10µA | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) | ||
| MC33PF8100FJESR2 | |||||||||||||||||||
| | Mfr Part No.MC33PF8101A0ESInternal Code1778-761-8893590 | NXP USA Inc. |
IC POWER MANAGEMENT
| 481 Available |
|
Unit Price:
$5.538 Minimum: 1 Multiple: 1 | - | Tray | Active | High Performance i.MX 8 Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) | |
| MC33PF8101A0ES | |||||||||||||||||||
| | Mfr Part No.MC33PF8101A0ESR2Internal Code1778-761-8893591 | NXP USA Inc. |
POWER MANAGEMENT IC I.MX8 NON-PR
| Get a Quote | - | - | Tape & Reel (TR) | Active | High Performance i.MX 8 Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) | ||
| MC33PF8101A0ESR2 | |||||||||||||||||||
| | Mfr Part No.MC33PF8200D2ESInternal Code1778-761-8893596 | NXP USA Inc. |
IC POWER MANAGEMENT
| Get a Quote | - | - | Tray | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) | ||
| MC33PF8200D2ES | |||||||||||||||||||
| | Mfr Part No.MC33PF8200D2ESR2Internal Code1778-761-8893598 | NXP USA Inc. |
POWER MANAGEMENT IC I.MX8 PRE-PR
| Get a Quote | - | - | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) | ||
| MC33PF8200D2ESR2 | |||||||||||||||||||
| | Mfr Part No.MC33PF8200DHESInternal Code1778-761-8893603 | NXP USA Inc. |
IC POWER MANAGEMENT I.MX8QM
| Get a Quote | - | - | Tray | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) | ||
| MC33PF8200DHES | |||||||||||||||||||
| | Mfr Part No.MC33PF8200EMESInternal Code1778-761-8893608 | NXP USA Inc. |
POWER MANAGEMENT IC I.MX8 PRE-PR
| Get a Quote | - | - | Tray | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) | ||
| MC33PF8200EMES | |||||||||||||||||||
| | Mfr Part No.MC33PF8200ETESInternal Code1778-761-8893611 | NXP USA Inc. |
IC POWER MANAGEMENT I.MX8QM
| Get a Quote | - | - | Tray | Active | High Performance i.MX 8, S32x Processor Based | - | 2.7V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) | ||
| MC33PF8200ETES |