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25,547 results

Compare	Part No	Manufacturer	Description	Inventory	Pricing	Quantity	Series	Packaging	Part Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature	Termination Post Length	Material Flammability Rating	Current Rating (Amps)	Contact Resistance
	Mfr Part No. 32-6553-11 Internal Code 270-409-1594052	Aries Electronics	CONN IC DIP SOCKET ZIF 32POS	Get a Quote	-		55	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-	0.110" (2.78mm)	UL94 V-0	1 A	-
32-6553-11 270-409-1594052 Aries Electronics RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 32-6554-11 Internal Code 270-409-1594056	Aries Electronics	CONN IC DIP SOCKET ZIF 32POS GLD	223 Available	1 : $17.3879 10 : $15.80718 100 : $14.502 500 : $13.42778 1000 : $12.54933 3000 : $11.83899	Unit Price: $17.3879 Minimum: 1 Multiple: 1	55	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	-	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-	0.110" (2.78mm)	UL94 V-0	1 A	-
32-6554-11 270-409-1594056 Aries Electronics RoHS : Package: - Inventory: 223 1 : $17.3879
	Mfr Part No. 32-6554-16 Internal Code 270-409-1594057	Aries Electronics	CONN IC DIP SOCKET ZIF 32POS	Get a Quote	-		55	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-	0.110" (2.78mm)	UL94 V-0	1 A	-
32-6554-16 270-409-1594057 Aries Electronics RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 32-6556-40 Internal Code 270-409-1594065	Aries Electronics	CONN IC DIP SOCKET 32POS GOLD	Get a Quote	-		6556	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder Cup	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-	0.180" (4.57mm)	UL94 V-0	3 A	-
32-6556-40 270-409-1594065 Aries Electronics RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 32-6570-11 Internal Code 270-409-1594071	Aries Electronics	CONN IC DIP SOCKET ZIF 32POS GLD	Get a Quote	-		57	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-	0.110" (2.78mm)	UL94 V-0	1 A	-
32-6570-11 270-409-1594071 Aries Electronics RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 32-6571-16 Internal Code 270-409-1594075	Aries Electronics	CONN IC DIP SOCKET ZIF 32POS	Get a Quote	-		57	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Polyphenylene Sulfide (PPS), Glass Filled	-	0.110" (2.78mm)	UL94 V-0	1 A	-
32-6571-16 270-409-1594075 Aries Electronics RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 32-6573-10 Internal Code 270-409-1594079	Aries Electronics	CONN IC DIP SOCKET ZIF 32POS TIN	Get a Quote	-		57	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-	0.110" (2.78mm)	UL94 V-0	1 A	-
32-6573-10 270-409-1594079 Aries Electronics RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 32-6573-16 Internal Code 270-409-1594081	Aries Electronics	CONN IC DIP SOCKET ZIF 32POS TIN	Get a Quote	-		57	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-	0.110" (2.78mm)	UL94 V-0	1 A	-
32-6573-16 270-409-1594081 Aries Electronics RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 32-6574-11 Internal Code 270-409-1594083	Aries Electronics	CONN IC DIP SOCKET ZIF 32POS TIN	Get a Quote	-		57	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-	0.110" (2.78mm)	UL94 V-0	1 A	-
32-6574-11 270-409-1594083 Aries Electronics RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 32-6575-10 Internal Code 270-409-1594086	Aries Electronics	CONN IC DIP SOCKET ZIF 32POS TIN	Get a Quote	-		57	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-	0.110" (2.78mm)	UL94 V-0	1 A	-
32-6575-10 270-409-1594086 Aries Electronics RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 32-6820-90C Internal Code 270-409-1594469	Aries Electronics	CONN IC DIP SOCKET 32POS GOLD	Get a Quote	-		Vertisockets™ 800	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C	0.140" (3.56mm)	UL94 V-0	3 A	-
32-6820-90C 270-409-1594469 Aries Electronics RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 32-6822-90C Internal Code 270-409-1594470	Aries Electronics	CONN IC DIP SOCKET 32POS GOLD	Get a Quote	-		Vertisockets™ 800	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C	0.140" (3.56mm)	UL94 V-0	3 A	-
32-6822-90C 270-409-1594470 Aries Electronics RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 326-93-132-41-001000 Internal Code 1599-409-1594977	Mill-Max Manufacturing Corp.	SOCKET WRAP SOLDERTAIL SIP 32POS	Get a Quote	-		326	Tube	Active	SIP	32 (1 x 32)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C	0.126" (3.20mm)	-	3 A	-
326-93-132-41-001000 1599-409-1594977 Mill-Max Manufacturing Corp. RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 326-93-132-41-002000 Internal Code 1599-409-1594978	Mill-Max Manufacturing Corp.	SOCKET WRAP SOLDERTAIL SIP 32POS	Get a Quote	-		326	Tube	Active	SIP	32 (1 x 32)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C	0.126" (3.20mm)	-	3 A	-
326-93-132-41-002000 1599-409-1594978 Mill-Max Manufacturing Corp. RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 326-93-132-41-003000 Internal Code 1599-409-1594979	Mill-Max Manufacturing Corp.	SOCKET WRAP SOLDERTAIL SIP 32POS	Get a Quote	-		326	Tube	Active	SIP	32 (1 x 32)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C	0.126" (3.20mm)	-	3 A	-
326-93-132-41-003000 1599-409-1594979 Mill-Max Manufacturing Corp. RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 32-7553-10 Internal Code 270-409-1596331	Aries Electronics	CONN SOCKET SIP 32POS TIN	Get a Quote	-		700 Elevator Strip-Line™	Bulk	Active	SIP	32 (1 x 32)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C	0.150" (3.81mm)	UL94 V-0	1.5 A	-
32-7553-10 270-409-1596331 Aries Electronics RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 32-81000-610C Internal Code 270-409-1596665	Aries Electronics	CONN IC DIP SOCKET 32POS GOLD	Get a Quote	-		8	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C	0.140" (3.56mm)	UL94 V-0	3 A	-
32-81000-610C 270-409-1596665 Aries Electronics RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 32-820-90C Internal Code 270-409-1596741	Aries Electronics	CONN IC DIP SOCKET 32POS GOLD	Get a Quote	-		Vertisockets™ 800	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C	0.140" (3.56mm)	UL94 V-0	3 A	-
32-820-90C 270-409-1596741 Aries Electronics RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 32-8600-610C Internal Code 270-409-1597307	Aries Electronics	CONN IC DIP SOCKET 32POS GOLD	Get a Quote	-		8	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C	0.140" (3.56mm)	UL94 V-0	3 A	-
32-8600-610C 270-409-1597307 Aries Electronics RoHS : Package: - Inventory: - 1 : -
	Mfr Part No. 32-8800-610C Internal Code 270-409-1597363	Aries Electronics	CONN ELEVATOR SOCKET 32 PIN .600	Get a Quote	-		8	-	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C	0.140" (3.56mm)	UL94 V-0	3 A	-
32-8800-610C 270-409-1597363 Aries Electronics RoHS : Package: - Inventory: - 1 : -

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