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25,547 results | remaining
Compare Image Part No Manufacturer Description Inventory Pricing Quantity SeriesPackagingPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating TemperatureTermination Post LengthMaterial Flammability RatingCurrent Rating (Amps)Contact Resistance
Compare Image Part No Manufacturer Description Inventory Pricing Quantity SeriesPackagingPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating TemperatureTermination Post LengthMaterial Flammability RatingCurrent Rating (Amps)Contact Resistance
32-1518-11

Mfr Part No.

32-1518-11

Internal Code

270-409-1580791
Aries Electronics
CONN IC DIP SOCKET 32POS GOLD
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518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled - 0.125" (3.18mm) UL94 V-0 3 A -
32-1518-11
32-1518-11

270-409-1580791 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
322-13-120-41-001000

Mfr Part No.

322-13-120-41-001000

Internal Code

1599-409-1582515
Mill-Max Manufacturing Corp.
SOCKET 2 LEVEL WRAPOST SIP 20POS
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322 Tube Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C 0.370" (9.40mm) - 3 A -
322-13-120-41-001000
322-13-120-41-001000

1599-409-1582515 Mill-Max Manufacturing Corp.
RoHS :
Package: -
Inventory: -
1 : -
322-13-132-41-001000

Mfr Part No.

322-13-132-41-001000

Internal Code

1599-409-1582527
Mill-Max Manufacturing Corp.
SOCKET 2 LEVEL WRAPOST SIP 32POS
56 Available
  • 1 : $21.752
  • 10 : $19.77454
  • 100 : $18.14178
  • 500 : $16.79796
  • 1000 : $15.69902
  • 3000 : $14.81039
Unit Price: $21.752
Minimum: 1 Multiple: 1
322 Tube Active SIP 32 (1 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C 0.370" (9.40mm) - 3 A -
322-13-132-41-001000
322-13-132-41-001000

1599-409-1582527 Mill-Max Manufacturing Corp.
RoHS :
Package: -
Inventory: 56
1 : $21.752
32-3503-21

Mfr Part No.

32-3503-21

Internal Code

270-409-1584969
Aries Electronics
CONN IC DIP SOCKET 32POS GOLD
Get a Quote -
503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C 0.360" (9.14mm) UL94 V-0 3 A -
32-3503-21
32-3503-21

270-409-1584969 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
32-3513-10T

Mfr Part No.

32-3513-10T

Internal Code

270-409-1584982
Aries Electronics
CONN IC DIP SOCKET 32POS GOLD
Get a Quote -
Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C 0.125" (3.18mm) UL94 V-0 3 A -
32-3513-10T
32-3513-10T

270-409-1584982 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
32-3513-11H

Mfr Part No.

32-3513-11H

Internal Code

270-409-1584984
Aries Electronics
CONN IC DIP SOCKET 32POS GOLD
Get a Quote -
Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C 0.125" (3.18mm) UL94 V-0 3 A -
32-3513-11H
32-3513-11H

270-409-1584984 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
32-3551-10

Mfr Part No.

32-3551-10

Internal Code

270-409-1584992
Aries Electronics
CONN IC DIP SOCKET ZIF 32POS TIN
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55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled - 0.110" (2.78mm) UL94 V-0 1 A -
32-3551-10
32-3551-10

270-409-1584992 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
32-3551-11

Mfr Part No.

32-3551-11

Internal Code

270-409-1584993
Aries Electronics
CONN IC DIP SOCKET ZIF 32POS GLD
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55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled - 0.110" (2.78mm) UL94 V-0 1 A -
32-3551-11
32-3551-11

270-409-1584993 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
32-3553-18

Mfr Part No.

32-3553-18

Internal Code

270-409-1585003
Aries Electronics
CONN IC DIP SOCKET ZIF 32POS
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55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C 0.110" (2.78mm) UL94 V-0 1 A -
32-3553-18
32-3553-18

270-409-1585003 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
32-3572-11

Mfr Part No.

32-3572-11

Internal Code

270-409-1585025
Aries Electronics
CONN IC DIP SOCKET ZIF 32POS GLD
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57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled - 0.110" (2.78mm) UL94 V-0 1 A -
32-3572-11
32-3572-11

270-409-1585025 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
32-3575-10

Mfr Part No.

32-3575-10

Internal Code

270-409-1585034
Aries Electronics
CONN IC DIP SOCKET ZIF 32POS
Get a Quote -
57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled - 0.110" (2.78mm) UL94 V-0 1 A -
32-3575-10
32-3575-10

270-409-1585034 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
C8120-04

Mfr Part No.

C8120-04

Internal Code

270-409-5259589
Aries Electronics
CONN IC DIP SOCKET 20POS TIN
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Edge-Grip™, C81 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C 0.675" (17.15mm) UL94 V-0 1.5 A -
C8120-04
C8120-04

270-409-5259589 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
C9108-00

Mfr Part No.

C9108-00

Internal Code

270-409-5263235
Aries Electronics
CONN IC DIP SOCKET 8POS GOLD
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Edge-Grip™, C91 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C 0.675" (17.15mm) UL94 V-0 1.5 A -
C9108-00
C9108-00

270-409-5263235 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
C9314-02

Mfr Part No.

C9314-02

Internal Code

270-409-5265420
Aries Electronics
CONN IC DIP SOCKET 14POS GOLD
Get a Quote -
Lo-PRO®file, C93 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C 0.140" (3.56mm) UL94 V-0 1 A 20mOhm
C9314-02
C9314-02

270-409-5265420 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
01-0508-31

Mfr Part No.

01-0508-31

Internal Code

270-409-37894
Aries Electronics
CONN SOCKET SIP 1POS GOLD
Get a Quote -
508 Bulk Active SIP 1 (1 x 1) - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C 0.500" (12.70mm) UL94 V-0 3 A -
01-0508-31
01-0508-31

270-409-37894 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
01-0513-11H

Mfr Part No.

01-0513-11H

Internal Code

270-409-37909
Aries Electronics
CONN SOCKET SIP 1POS GOLD
Get a Quote -
0513 Bulk Active SIP 1 (1 x 1) - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled - 0.125" (3.18mm) UL94 V-0 3 A -
01-0513-11H
01-0513-11H

270-409-37909 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
01-0518-00

Mfr Part No.

01-0518-00

Internal Code

270-409-37911
Aries Electronics
CONN SOCKET SIP 1POS GOLD
Get a Quote -
518 Bulk Active SIP 1 (1 x 1) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled - 0.046" (1.17mm) UL94 V-0 3 A -
01-0518-00
01-0518-00

270-409-37911 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
02-0503-20

Mfr Part No.

02-0503-20

Internal Code

270-409-65006
Aries Electronics
CONN SOCKET SIP 2POS GOLD
Get a Quote -
0503 Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled - 0.360" (9.14mm) UL94 HB 3 A -
02-0503-20
02-0503-20

270-409-65006 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
02-0508-21

Mfr Part No.

02-0508-21

Internal Code

270-409-65012
Aries Electronics
CONN SOCKET SIP 2POS GOLD
Get a Quote -
508 Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C 0.360" (9.14mm) UL94 V-0 3 A -
02-0508-21
02-0508-21

270-409-65012 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
02-0513-11

Mfr Part No.

02-0513-11

Internal Code

270-409-65023
Aries Electronics
CONN SOCKET SIP 2POS GOLD
Get a Quote -
0513 Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled - 0.125" (3.18mm) UL94 V-0 3 A -
02-0513-11
02-0513-11

270-409-65023 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
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