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25,547 results | remaining
Compare Image Part No Manufacturer Description Inventory Pricing Quantity SeriesPackagingPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating TemperatureTermination Post LengthMaterial Flammability RatingCurrent Rating (Amps)Contact Resistance
Compare Image Part No Manufacturer Description Inventory Pricing Quantity SeriesPackagingPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating TemperatureTermination Post LengthMaterial Flammability RatingCurrent Rating (Amps)Contact Resistance
18-81125-610C

Mfr Part No.

18-81125-610C

Internal Code

270-409-1044386
Aries Electronics
CONN IC DIP SOCKET 18POS GOLD
Get a Quote -
8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C 0.140" (3.56mm) UL94 V-0 3 A -
18-81125-610C
18-81125-610C

270-409-1044386 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
18-81240-610C

Mfr Part No.

18-81240-610C

Internal Code

270-409-1044395
Aries Electronics
CONN IC DIP SOCKET 18POS GOLD
Get a Quote -
8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C 0.140" (3.56mm) UL94 V-0 3 A -
18-81240-610C
18-81240-610C

270-409-1044395 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
18-81250-310C

Mfr Part No.

18-81250-310C

Internal Code

270-409-1044397
Aries Electronics
CONN IC DIP SOCKET 18POS GOLD
Get a Quote -
8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C 0.140" (3.56mm) UL94 V-0 3 A -
18-81250-310C
18-81250-310C

270-409-1044397 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
18-81250-610C

Mfr Part No.

18-81250-610C

Internal Code

270-409-1044398
Aries Electronics
CONN IC DIP SOCKET 18POS GOLD
Get a Quote -
8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C 0.140" (3.56mm) UL94 V-0 3 A -
18-81250-610C
18-81250-610C

270-409-1044398 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
18-822-90C

Mfr Part No.

18-822-90C

Internal Code

270-409-1044573
Aries Electronics
CONN IC DIP SOCKET 18POS GOLD
Get a Quote -
Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C 0.140" (3.56mm) UL94 V-0 3 A -
18-822-90C
18-822-90C

270-409-1044573 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
18-822-90E

Mfr Part No.

18-822-90E

Internal Code

270-409-1044574
Aries Electronics
CONN IC DIP SOCKET 18POS TIN
Get a Quote -
Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 - 0.150" (3.81mm) UL94 V-0 1.5 A -
18-822-90E
18-822-90E

270-409-1044574 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
18-8355-610C

Mfr Part No.

18-8355-610C

Internal Code

270-409-1044816
Aries Electronics
CONN IC DIP SOCKET 18POS GOLD
Get a Quote -
8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C 0.140" (3.56mm) UL94 V-0 3 A -
18-8355-610C
18-8355-610C

270-409-1044816 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
18-8375-310C

Mfr Part No.

18-8375-310C

Internal Code

270-409-1044870
Aries Electronics
CONN IC DIP SOCKET 18POS GOLD
Get a Quote -
8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C 0.140" (3.56mm) UL94 V-0 3 A -
18-8375-310C
18-8375-310C

270-409-1044870 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
18-8400-610C

Mfr Part No.

18-8400-610C

Internal Code

270-409-1044975
Aries Electronics
CONN IC DIP SOCKET 18POS GOLD
Get a Quote -
8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C 0.140" (3.56mm) UL94 V-0 3 A -
18-8400-610C
18-8400-610C

270-409-1044975 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
18-8532-610C

Mfr Part No.

18-8532-610C

Internal Code

270-409-1045227
Aries Electronics
CONN IC DIP SOCKET 18POS GOLD
Get a Quote -
8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C 0.140" (3.56mm) UL94 V-0 3 A -
18-8532-610C
18-8532-610C

270-409-1045227 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
18-8540-610C

Mfr Part No.

18-8540-610C

Internal Code

270-409-1045241
Aries Electronics
CONN IC DIP SOCKET 18POS GOLD
Get a Quote -
8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C 0.140" (3.56mm) UL94 V-0 3 A -
18-8540-610C
18-8540-610C

270-409-1045241 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
18-8650-610C

Mfr Part No.

18-8650-610C

Internal Code

270-409-1045494
Aries Electronics
CONN IC DIP SOCKET 18POS GOLD
Get a Quote -
8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C 0.140" (3.56mm) UL94 V-0 3 A -
18-8650-610C
18-8650-610C

270-409-1045494 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
18-8670-610C

Mfr Part No.

18-8670-610C

Internal Code

270-409-1045528
Aries Electronics
CONN IC DIP SOCKET 18POS GOLD
Get a Quote -
8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C 0.140" (3.56mm) UL94 V-0 3 A -
18-8670-610C
18-8670-610C

270-409-1045528 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
18-8685-610C

Mfr Part No.

18-8685-610C

Internal Code

270-409-1045551
Aries Electronics
CONN IC DIP SOCKET 18POS GOLD
Get a Quote -
8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C 0.140" (3.56mm) UL94 V-0 3 A -
18-8685-610C
18-8685-610C

270-409-1045551 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
18-8750-310C

Mfr Part No.

18-8750-310C

Internal Code

270-409-1045677
Aries Electronics
CONN IC DIP SOCKET 18POS GOLD
Get a Quote -
8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C 0.140" (3.56mm) UL94 V-0 3 A -
18-8750-310C
18-8750-310C

270-409-1045677 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
19-0501-21

Mfr Part No.

19-0501-21

Internal Code

270-409-1052464
Aries Electronics
CONN SOCKET SIP 19POS GOLD
Get a Quote -
501 Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C 0.420" (10.67mm) UL94 V-0 1 A -
19-0501-21
19-0501-21

270-409-1052464 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
19-0501-30

Mfr Part No.

19-0501-30

Internal Code

270-409-1052465
Aries Electronics
CONN SOCKET SIP 19POS TIN
Get a Quote -
501 Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C 0.690" (17.52mm) UL94 V-0 1 A -
19-0501-30
19-0501-30

270-409-1052465 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
19-0501-31

Mfr Part No.

19-0501-31

Internal Code

270-409-1052466
Aries Electronics
CONN SOCKET SIP 19POS GOLD
Get a Quote -
501 Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C 0.690" (17.52mm) UL94 V-0 1 A -
19-0501-31
19-0501-31

270-409-1052466 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
19-0503-20

Mfr Part No.

19-0503-20

Internal Code

270-409-1052473
Aries Electronics
CONN SOCKET SIP 19POS GOLD
Get a Quote -
0503 Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled - 0.360" (9.14mm) UL94 HB 3 A -
19-0503-20
19-0503-20

270-409-1052473 Aries Electronics
RoHS :
Package: -
Inventory: -
1 : -
19-0508-20

Mfr Part No.

19-0508-20

Internal Code

270-409-1052499
Aries Electronics
CONN SOCKET SIP 19POS GOLD
Get a Quote -
508 Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C 0.360" (9.14mm) UL94 V-0 3 A -
19-0508-20
19-0508-20

270-409-1052499 Aries Electronics
RoHS :
Package: -
Inventory: -
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